Thermal stability and activity improvements of a Ca-independent α-amylase fromBacillus subtilisCN7 by C-terminal truncation and hexahistidine-tag fusion

2014 ◽  
Vol 61 (2) ◽  
pp. 93-100 ◽  
Author(s):  
Chenghua Wang ◽  
Qingyan Wang ◽  
Siming Liao ◽  
Bingfang He ◽  
Ribo Huang
Keyword(s):  
Thermal Stability ◽  
Hexahistidine Tag

The Ordered Phase Formation in Ti-Al-Ga Alloys

1970 ◽  
Vol 28 ◽  
pp. 440-441
Author(s):  
Shiro Fujishiro ◽  
Harold L. Gegel
Keyword(s):  
Thermal Stability ◽  
High Temperature ◽  
Titanium Alloys ◽  
Growth Kinetics ◽  
Stoichiometric Composition ◽  
Good Potential ◽  
Alpha Titanium ◽  
Cold Rolled ◽  
Kinetics Of ◽  
Thermal Stability Of

Ordered-alpha titanium alloys having a DO19 type structure have good potential for high temperature (600°C) applications, due to the thermal stability of the ordered phase and the inherent resistance to recrystallization of these alloys. Five different Ti-Al-Ga alloys consisting of equal atomic percents of aluminum and gallium solute additions up to the stoichiometric composition, Ti3(Al, Ga), were used to study the growth kinetics of the ordered phase and the nature of its interface.The alloys were homogenized in the beta region in a vacuum of about 5×10-7 torr, furnace cooled; reheated in air to 50°C below the alpha transus for hot working. The alloys were subsequently acid cleaned, annealed in vacuo, and cold rolled to about. 050 inch prior to additional homogenization

Microstructure studies of tungsten silicide schottky contacts on Gaas

1987 ◽  
Vol 45 ◽  
pp. 328-329
Author(s):  
Yih-Cheng Shih ◽  
E. L. Wilkie
Keyword(s):  
Thermal Stability ◽  
Field Effect Transistors ◽  
Schottky Contact ◽  
Schottky Contacts ◽  
Excellent Thermal Stability ◽  
Barrier Heights ◽  
Gaas Substrates ◽  
Film Adhesion ◽  
Threshold Voltages ◽  
Thermal Stability Of

Tungsten silicides (WSix) have been successfully used as the gate materials in self-aligned GaAs metal-semiconductor-field- effect transistors (MESFET). Thermal stability of the WSix/GaAs Schottky contact is of major concern since the n+ implanted source/drain regions must be annealed at high temperatures (∼ 800°C). WSi0.6 was considered the best composition to achieve good device performance due to its low stress and excellent thermal stability of the WSix/GaAs interface. The film adhesion and the uniformity in barrier heights and ideality factors of the WSi0.6 films have been improved by depositing a thin layer of pure W as the first layer on GaAs prior to WSi0.6 deposition. Recently WSi0.1 has been used successfully as the gate material in 1x10 μm GaAs FET's on the GaAs substrates which were sputter-cleaned prior to deposition. These GaAs FET's exhibited uniform threshold voltages across a 51 mm wafer with good film adhesion after annealing at 800°C for 10 min.

Evolution of the microstructure of Cu(Ti)/SiO2 layers annealed in NH3

1995 ◽  
Vol 53 ◽  
pp. 452-453
Author(s):  
J. Liu ◽  
N. D. Theodore ◽  
D. Adams ◽  
S. Russell ◽  
T. L. Alford ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Titanium Nitride ◽  
Large Scale ◽  
Standard Procedure ◽  
Alloy Film ◽  
Electron Beam Evaporation ◽  
Copper Metallization ◽  
Nominal Composition ◽  
Ti Alloy ◽  
Thermally Grown

Copper-based metallization has recently attracted extensive research because of its potential application in ultra-large-scale integration (ULSI) of semiconductor devices. The feasibility of copper metallization is, however, limited due to its thermal stability issues. In order to utilize copper in metallization systems diffusion barriers such as titanium nitride and other refractory materials, have been employed to enhance the thermal stability of copper. Titanium nitride layers can be formed by annealing Cu(Ti) alloy film evaporated on thermally grown SiO2 substrates in an ammonia ambient. We report here the microstructural evolution of Cu(Ti)/SiO2 layers during annealing in NH3 flowing ambient.The Cu(Ti) films used in this experiment were prepared by electron beam evaporation onto thermally grown SiO2 substrates. The nominal composition of the Cu(Ti) alloy was Cu73Ti27. Thermal treatments were conducted in NH3 flowing ambient for 30 minutes at temperatures ranging from 450°C to 650°C. Cross-section TEM specimens were prepared by the standard procedure.

Thermal stability and decomposition of perfluoroalkyl substances on spent granular activated carbon

2020 ◽  
Author(s):  
Feng Xiao ◽  
Bin Yao ◽  
Pavankumar Challa Sasi ◽  
Svetlana Golovko ◽  
Dana Soli ◽  
...  
Keyword(s):  
Thermal Stability ◽  
Activated Carbon ◽  
Granular Activated Carbon ◽  
Perfluoroalkyl Substances

Thermal stability of Al-Cu-Fe icosahedral alloys

1991 ◽  
Vol 1 (12) ◽  
pp. 1823-1836 ◽  
Author(s):  
M. Bessière ◽  
A. Quivy ◽  
S. Lefebvre ◽  
J. Devaud-Rzepski ◽  
Y. Calvayrac
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of

Practical criteria for the thermal stability of a unidimensional superconductor

1994 ◽  
Vol 4 (4) ◽  
pp. 653-657
Author(s):  
B. Bonzi ◽  
M. El Khomssi ◽  
H. Lanchon-Ducauquis
Keyword(s):  
Thermal Stability ◽  
Thermal Stability Of

Time and thermal stability of magnetic properties of amorphous Fe80TM3B17 alloys

1998 ◽  
Vol 08 (PR2) ◽  
pp. Pr2-63-Pr2-66 ◽  
Author(s):  
R. Varga ◽  
P. Vojtaník ◽  
A. Lovas
Keyword(s):  
Thermal Stability ◽  
Magnetic Properties ◽  
Thermal Stability Of

Thermal gravimetric analysis of in-situ crosslinked nanocellulose whiskers • poly(methyl vinyl ether-co-maleic acid) • polyethylene glycol

TAPPI Journal ◽  
2011 ◽  
Vol 10 (4) ◽  
pp. 29-33
Author(s):  
LEE A. GOETZ ◽  
AJI P. MATHEW ◽  
KRISTIINA OKSMAN ◽  
ARTHUR J. RAGAUSKAS
Keyword(s):  
Thermal Stability ◽  
Polyethylene Glycol ◽  
Vinyl Ether ◽  
Thermal Gravimetric Analysis ◽  
Maleic Acid ◽  
Gravimetric Analysis ◽  
Thermal Gravimetric ◽  
Methyl Vinyl ◽  
Methyl Vinyl Ether

The thermal stability and decomposition of in-situ crosslinked nanocellulose whiskers – poly(methyl vinyl ether-co-maleic acid) – polyethylene glycol formulations (PMVEMA-PEG), (25%, 50%, and 75% whiskers) – were investigated using thermal gravimetric analysis (TGA) methods. The thermal degradation behavior of the films varied according to the percent cellulose whiskers in each formulation. The presence of cellulose whiskers increased the thermal stability of the PMVEMA-PEG matrix.

Thermal stability of tunnel junctions with additional oxidation at the surface of the bottom electrode.

2003 ◽  
Vol 27 (4) ◽  
pp. 303-306 ◽  
Author(s):  
S. Iura ◽  
H. Kubota ◽  
Y. Ando ◽  
T. Miyazaki
Keyword(s):  
Thermal Stability ◽  
Bottom Electrode ◽  
Tunnel Junctions ◽  
Thermal Stability Of
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