Molecular dynamics simulation of void electromigration under a high-density electric current stress in an aluminum interconnection
1995 ◽
Vol 78
(12)
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pp. 82-95
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1995 ◽
Vol 91
(1-4)
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pp. 220-226
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2012 ◽
Vol 715-716
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pp. 599-604
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2020 ◽
Vol 22
(29)
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pp. 16978-16984
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