scholarly journals Terminal Imido Complexes of thje Groups 9‐11: Electronic Structure and Developments in the Last Decade

Author(s):  
Annette Grünwald ◽  
S. S. Anjana ◽  
Dominik Munz
1991 ◽  
Vol 30 (19) ◽  
pp. 3595-3604 ◽  
Author(s):  
Mark H. Schofield ◽  
Terence P. Kee ◽  
Jens T. Anhaus ◽  
Richard R. Schrock ◽  
Keith H. Johnson ◽  
...  

2020 ◽  
Vol 56 (21) ◽  
pp. 3163-3166 ◽  
Author(s):  
Yuyang Dong ◽  
Ryan M. Clarke ◽  
Shao-Liang Zheng ◽  
Theodore A. Betley

We report a family of dipyrrinato Cr imido complexes in oxidation states ranging from CrIII to CrV showcasing the influence of the weak-field dipyrrin on the electronic structure and coordination geometries of the Cr imides.


Author(s):  
S.J. Splinter ◽  
J. Bruley ◽  
P.E. Batson ◽  
D.A. Smith ◽  
R. Rosenberg

It has long been known that the addition of Cu to Al interconnects improves the resistance to electromigration failure. It is generally accepted that this improvement is the result of Cu segregation to Al grain boundaries. The exact mechanism by which segregated Cu increases service lifetime is not understood, although it has been suggested that the formation of thin layers of θ-CuA12 (or some metastable substoichiometric precursor, θ’ or θ”) at the boundaries may be necessary. This paper reports measurements of the local electronic structure of Cu atoms segregated to Al grain boundaries using spatially resolved EELS in a UHV STEM. It is shown that segregated Cu exists in a chemical environment similar to that of Cu atoms in bulk θ-phase precipitates.Films of 100 nm thickness and nominal composition Al-2.5wt%Cu were deposited by sputtering from alloy targets onto NaCl substrates. The samples were solution heat treated at 748K for 30 min and aged at 523K for 4 h to promote equilibrium grain boundary segregation. EELS measurements were made using a Gatan 666 PEELS spectrometer interfaced to a VG HB501 STEM operating at 100 keV. The probe size was estimated to be 1 nm FWHM. Grain boundaries with the narrowest projected width were chosen for analysis. EDX measurements of Cu segregation were made using a VG HB603 STEM.


Author(s):  
J. Fink

Conducting polymers comprises a new class of materials achieving electrical conductivities which rival those of the best metals. The parent compounds (conjugated polymers) are quasi-one-dimensional semiconductors. These polymers can be doped by electron acceptors or electron donors. The prototype of these materials is polyacetylene (PA). There are various other conjugated polymers such as polyparaphenylene, polyphenylenevinylene, polypoyrrole or polythiophene. The doped systems, i.e. the conducting polymers, have intersting potential technological applications such as replacement of conventional metals in electronic shielding and antistatic equipment, rechargable batteries, and flexible light emitting diodes.Although these systems have been investigated almost 20 years, the electronic structure of the doped metallic systems is not clear and even the reason for the gap in undoped semiconducting systems is under discussion.


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