scholarly journals Inkjet Printing of Liquid Silicon

2020 ◽  
Vol 41 (23) ◽  
pp. 2070051
Author(s):  
Takashi Masuda ◽  
Maui Nakayama ◽  
Kimihiko Saito ◽  
Hirotaka Katayama ◽  
Akira Terakawa
2020 ◽  
Vol 41 (23) ◽  
pp. 2000362
Author(s):  
Takashi Masuda ◽  
Maui Nakayama ◽  
Kimihiko Saito ◽  
Hirotaka Katayama ◽  
Akira Terakawa

Author(s):  
K Das Chowdhury ◽  
R. W. Carpenter ◽  
W. Braue

Research on reaction-bonded SiC (RBSiC) is aimed at developing a reliable structural ceramic with improved mechanical properties. The starting materials for RBSiC were Si,C and α-SiC powder. The formation of the complex microstructure of RBSiC involves (i) solution of carbon in liquid silicon, (ii) nucleation and epitaxial growth of secondary β-SiC on the original α-SiC grains followed by (iii) β>α-SiC phase transformation of newly formed SiC. Due to their coherent nature, epitaxial SiC/SiC interfaces are considered to be segregation-free and “strong” with respect to their effect on the mechanical properties of RBSiC. But the “weak” Si/SiC interface limits its use in high temperature situations. However, few data exist on the structure and chemistry of these interfaces. Microanalytical results obtained by parallel EELS and HREM imaging are reported here.


Author(s):  
Alfonso Arturo Castrejon-Pita ◽  
Eleanor S Betton ◽  
Nick Campbell ◽  
Nick Jackson ◽  
Jonathan Morgan ◽  
...  
Keyword(s):  

2019 ◽  
Vol 2019 (1) ◽  
pp. 56-59
Author(s):  
Erik Beckert ◽  
Falk Kemper ◽  
Sabrina-Jasmin Wolleb ◽  
Maximilian Reif ◽  
Soenke Steenhusen
Keyword(s):  

2018 ◽  
Vol 2018 (1) ◽  
pp. 107-112 ◽  
Author(s):  
Min Zhao ◽  
Susana Diaz Amaya ◽  
Seon-ah Jin ◽  
Li-Kai Lin ◽  
Amanda J. Deering ◽  
...  

2017 ◽  
Vol 61 (5) ◽  
pp. 505051-505057 ◽  
Author(s):  
Zundong Liu ◽  
Kuanjun Fang ◽  
Hongguo Gao ◽  
Xiuming Liu ◽  
Jianfei Zhang ◽  
...  

2020 ◽  
Vol 64 (5) ◽  
pp. 50405-1-50405-5
Author(s):  
Young-Woo Park ◽  
Myounggyu Noh

Abstract Recently, the three-dimensional (3D) printing technique has attracted much attention for creating objects of arbitrary shape and manufacturing. For the first time, in this work, we present the fabrication of an inkjet printed low-cost 3D temperature sensor on a 3D-shaped thermoplastic substrate suitable for packaging, flexible electronics, and other printed applications. The design, fabrication, and testing of a 3D printed temperature sensor are presented. The sensor pattern is designed using a computer-aided design program and fabricated by drop-on-demand inkjet printing using a magnetostrictive inkjet printhead at room temperature. The sensor pattern is printed using commercially available conductive silver nanoparticle ink. A moving speed of 90 mm/min is chosen to print the sensor pattern. The inkjet printed temperature sensor is demonstrated, and it is characterized by good electrical properties, exhibiting good sensitivity and linearity. The results indicate that 3D inkjet printing technology may have great potential for applications in sensor fabrication.


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