A silicon rubber composite with enhanced thermal conductivity and mechanical properties based on nanodiamond and boron nitride fillers

2021 ◽  
Author(s):  
Jiaying Qu ◽  
Lu Fan ◽  
Jean Felix Mukerabigwi ◽  
Cui Liu ◽  
Yu Cao
RSC Advances ◽  
2014 ◽  
Vol 4 (83) ◽  
pp. 44282-44290 ◽  
Author(s):  
Jun Hou ◽  
Guohua Li ◽  
Na Yang ◽  
Lili Qin ◽  
Maryam E. Grami ◽  
...  

The fabricated surface modified boron nitride epoxy composites exhibit high thermal conductivity, superior thermal stability and good mechanical properties while retaining good electrical insulation properties.


2013 ◽  
Vol 753-755 ◽  
pp. 2379-2382
Author(s):  
Shi Meng Xu ◽  
Run Bo Ma ◽  
Jian Hua Du ◽  
Jun Hong Liu ◽  
Qi Jin

Filled the N330 carbon black, silica T80 carbon black and Al powder and Fe2O3 magnetic nanoparticles, the rubber composites on multi-component electromagnetic fillers were prepared according to orthogonal experiment analysis, and the preliminary experiment conclusions of the filler prescription designs were given; Based on the experiment design, the mechanical properties and thermal conductivity of the rubber composite were tested, and the testing results were analyzed by using variance analysis. Thus, the paper shows that the effects of N330 on rubber mechanical properties are significant, and the effects of Al powder on the rubber thermal conductivity are significant. Moreover, it is highly emphasized in this paper that the orthogonal experiment design must be carefully explored before the tests are executed.


Nanomaterials ◽  
2021 ◽  
Vol 11 (2) ◽  
pp. 373 ◽  
Author(s):  
Lorenzo Pezzana ◽  
Giacomo Riccucci ◽  
Silvia Spriano ◽  
Daniele Battegazzore ◽  
Marco Sangermano ◽  
...  

This study demonstrates the possibility of forming 3D structures with enhanced thermal conductivity (k) by vat printing a silicone–acrylate based nanocomposite. Polydimethylsiloxane (PDSM) represent a common silicone-based polymer used in several applications from electronics to microfluidics. Unfortunately, the k value of the polymer is low, so a composite is required to be formed in order to increase its thermal conductivity. Several types of fillers are available to reach this result. In this study, boron nitride (BN) nanoparticles were used to increase the thermal conductivity of a PDMS-like photocurable matrix. A digital light processing (DLP) system was employed to form complex structures. The viscosity of the formulation was firstly investigated; photorheology and attenuate total reflection Fourier-transform infrared spectroscopy (ATR-FTIR) analyses were done to check the reactivity of the system that resulted as suitable for DLP printing. Mechanical and thermal analyses were performed on printed samples through dynamic mechanical thermal analysis (DMTA) and tensile tests, revealing a positive effect of the BN nanoparticles. Morphological characterization was performed by scanning electron microscopy (SEM). Finally, thermal analysis demonstrated that the thermal conductivity of the material was improved, maintaining the possibility of producing 3D printable formulations.


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