A Novel Approach in Herbal Quality Control Using Hyperspectral Imaging: Discriminating Between Sceletium tortuosum and Sceletium crassicaule

2013 ◽  
Vol 24 (6) ◽  
pp. 550-555 ◽  
Author(s):  
Emmanuel Amukohe Shikanga ◽  
Alvaro M. Viljoen ◽  
Ilze Vermaak ◽  
Sandra Combrinck
Molecules ◽  
2014 ◽  
Vol 19 (9) ◽  
pp. 13104-13121 ◽  
Author(s):  
Maxleene Sandasi ◽  
IIze Vermaak ◽  
Weiyang Chen ◽  
Alvaro Viljoen

2018 ◽  
Vol 4 (10) ◽  
pp. 110 ◽  
Author(s):  
Florian Gruber ◽  
Philipp Wollmann ◽  
Wulf Grählert ◽  
Stefan Kaskel

A hyperspectral measurement system for the fast and large area measurement of Raman and fluorescence signals was developed, characterized and tested. This laser hyperspectral imaging system (Laser-HSI) can be used for sorting tasks and for continuous quality monitoring. The system uses a 532 nm Nd:YAG laser and a standard pushbroom HSI camera. Depending on the lens selected, it is possible to cover large areas (e.g., field of view (FOV) = 386 mm) or to achieve high spatial resolutions (e.g., 0.02 mm). The developed Laser-HSI was used for four exemplary experiments: (a) the measurement and classification of a mixture of sulphur and naphthalene; (b) the measurement of carotenoid distribution in a carrot slice; (c) the classification of black polymer particles; and, (d) the localization of impurities on a lead zirconate titanate (PZT) piezoelectric actuator. It could be shown that the measurement data obtained were in good agreement with reference measurements taken with a high-resolution Raman microscope. Furthermore, the suitability of the measurements for classification using machine learning algorithms was also demonstrated. The developed Laser-HSI could be used in the future for complex quality control or sorting tasks where conventional HSI systems fail.


Cytometry ◽  
2001 ◽  
Vol 43 (4) ◽  
pp. 239-247 ◽  
Author(s):  
Roger A. Schultz ◽  
Thomas Nielsen ◽  
Jeff R. Zavaleta ◽  
Raynal Ruch ◽  
Robert Wyatt ◽  
...  

Respirology ◽  
2003 ◽  
Vol 8 (3) ◽  
pp. 365-370 ◽  
Author(s):  
Holger J. SCHÜNEMANN ◽  
Jacek DMOCHOWSKI ◽  
Lucy A. CAMPBELL ◽  
Brydon J. B. GRANT

2018 ◽  
Vol 144 ◽  
pp. 80-85 ◽  
Author(s):  
Tetsuro Ishida ◽  
Junichi Kurihara ◽  
Fra Angelico Viray ◽  
Shielo Baes Namuco ◽  
Enrico C. Paringit ◽  
...  

1997 ◽  
Vol 5 (9) ◽  
pp. 8-11
Author(s):  
Joseph Rubin ◽  
Tim Hazeldine

The planarizing technique of materials lapping and polishing shows many benefits in providing samples for optical microscopy in failure analysis, quality control and related fields. A method is described below which provides both rapid and accurate micro-sections of pcb's, wafers, packaged components and other processed materials, with the use of a novel approach involving a 'calibrated' polishing base and a 'Micropositioner' head. Other benefits include the ability to halt material removal at a predetermined process endpoint and convenient sample mounting techniques.


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