Yield stress and rheological characterization of the low shear zone of an epoxy molding compound for encapsulation of semiconductor devices

2008 ◽  
Vol 48 (4) ◽  
pp. 747-755 ◽  
Author(s):  
Masaki Yoshii
Keyword(s):  
Yield Stress ◽  
Shear Zone ◽  
Semiconductor Devices ◽  
Rheological Characterization ◽  
Epoxy Molding Compound ◽  
Molding Compound ◽  
Low Shear

Characterization of the rheological properties of a fast-curing epoxy-molding compound

1997 ◽  
Vol 41 (2) ◽  
pp. 177-195 ◽  
Author(s):  
Sejin Han ◽  
K. K. Wang ◽  
C. A. Hieber ◽  
C. Cohen
Keyword(s):  
Rheological Properties ◽  
Epoxy Molding Compound ◽  
Molding Compound

Physicochemical and Electro-Rheological Characterization of Kaolinite / CMS / Silicone Oil Fluid

2010 ◽  
Vol 446 ◽  
pp. 33-41
Author(s):  
Thomas Reiss ◽  
Saoussen Laribi ◽  
Jean-Marie Fleureau ◽  
Jean Francois Tassin
Keyword(s):  
Electric Field ◽  
Yield Stress ◽  
Applied Electric Field ◽  
Silicone Oil ◽  
Rheological Behaviour ◽  
Rheological Characterization ◽  
Clay Particles ◽  
Observed Behaviour ◽  
Composite Nature

The aim of this study is to elaborate electro-rheological fluids based on kaolinite. the scientific characterization made it possible the identification of the composite nature and the checking of the intercalation of the polymer among the clay particles The rheological behaviour of the fluid depends on the electric field. A yield stress of the suspensions is observed, which increases with the applied electric field. An interpretation based on the different modes of association between the clay particles is proposed to account qualitatively for the observed behaviour.

scholarly journals Thermal Reaction Characterization of an Epoxy Molding Compound

2001 ◽  
Vol 33 (1) ◽  
pp. 49-53 ◽  
Author(s):  
Man Geng Lu ◽  
Hyeong-Ki Choi ◽  
Hong-Ki Lee ◽  
Mi-Ja Shim ◽  
Sang Wook Kim
Keyword(s):  
Thermal Reaction ◽  
Epoxy Molding Compound ◽  
Molding Compound
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