Highly Porous Silicon Nanowires Made with Solvent-Mediated Wet Chemical Etching and Their Thermoelectric Applications

2017 ◽  
Vol 2 (33) ◽  
pp. 10865-10870 ◽  
Author(s):  
Chien-Hsin Tang ◽  
Wen-Jin Li ◽  
Chia-Hsiang Hung ◽  
Po-Hsuan Hsiao ◽  
Chia-Yun Chen
Keyword(s):  
Porous Silicon ◽  
Silicon Nanowires ◽  
Chemical Etching ◽  
Porous Silicon Nanowires ◽  
Wet Chemical ◽  
Wet Chemical Etching ◽  
Highly Porous

scholarly journals Fabrication and Photovoltaic Characteristics of Coaxial Silicon Nanowire Solar Cells Prepared by Wet Chemical Etching

2012 ◽  
Vol 2012 ◽  
pp. 1-8 ◽  
Author(s):  
Chien-Wei Liu ◽  
Chin-Lung Cheng ◽  
Bau-Tong Dai ◽  
Chi-Han Yang ◽  
Jun-Yuan Wang
Keyword(s):  
Solar Cells ◽  
Silicon Nanowires ◽  
Chemical Etching ◽  
Low Cost ◽  
Light Trapping ◽  
Silicon Nanowire ◽  
Great Promise ◽  
Etching Time ◽  
Wet Chemical ◽  
Wet Chemical Etching

Nanostructured solar cells with coaxial p-n junction structures have strong potential to enhance the performances of the silicon-based solar cells. This study demonstrates a radial junction silicon nanowire (RJSNW) solar cell that was fabricated simply and at low cost using wet chemical etching. Experimental results reveal that the reflectance of the silicon nanowires (SNWs) declines as their length increases. The excellent light trapping was mainly associated with high aspect ratio of the SNW arrays. A conversion efficiency of ∼7.1% and an external quantum efficiency of ∼64.6% at 700 nm were demonstrated. Control of etching time and diffusion conditions holds great promise for the development of future RJSNW solar cells. Improving the electrode/RJSNW contact will promote the collection of carries in coaxial core-shell SNW array solar cells.

scholarly journals Antireflective silicon surface with vertical-aligned silicon nanowires realized by simple wet chemical etching processes

2011 ◽  
Vol 19 (17) ◽  
pp. 15792 ◽  
Author(s):  
Yung-Jr Hung ◽  
San-Liang Lee ◽  
Kai-Chung Wu ◽  
Yian Tai ◽  
Yen-Ting Pan
Keyword(s):  
Silicon Nanowires ◽  
Chemical Etching ◽  
Silicon Surface ◽  
Wet Chemical ◽  
Wet Chemical Etching

Structural and optical characteristics of silicon nanowires fabricated by wet chemical etching

2011 ◽  
Vol 511 (1-3) ◽  
pp. 106-109 ◽  
Author(s):  
Meiguang Zhu ◽  
Xuejiao Chen ◽  
Zhiliang Wang ◽  
Yun Chen ◽  
Dianfei Ma ◽  
...  
Keyword(s):  
Silicon Nanowires ◽  
Chemical Etching ◽  
Optical Characteristics ◽  
Wet Chemical ◽  
Wet Chemical Etching

Photoluminescence of samples produced by electroless wet chemical etching: Between silicon nanowires and porous structures

2011 ◽  
Vol 208 (4) ◽  
pp. 893-899 ◽  
Author(s):  
Felix Voigt ◽  
Vladimir Sivakov ◽  
Viktor Gerliz ◽  
Gottfried H. Bauer ◽  
Björn Hoffmann ◽  
...  
Keyword(s):  
Silicon Nanowires ◽  
Chemical Etching ◽  
Porous Structures ◽  
Wet Chemical ◽  
Wet Chemical Etching

Decapsulation Techniques for Cu Wire Bonding Package

2009 ◽  
Author(s):  
Dongmei Meng ◽  
Joe Rupley ◽  
Chris McMahon
Keyword(s):  
Laser Ablation ◽  
Thin Layer ◽  
Chemical Etching ◽  
Wire Bonding ◽  
Methods And Techniques ◽  
Wet Chemical ◽  
Wet Chemical Etching ◽  
Reliability Issue ◽  
Etch Time ◽  
Device Technology

Abstract This paper presents decapsulation solutions for devices bonded with Cu wire. By removing mold compound to a thin layer using a laser ablation tool, Cu wire bonded packages are decapsulated using wet chemical etching by controlling the etch time and temperature. Further, the paper investigates the possibilities of decapsulating Cu wire bonded devices using full wet chemical etches without the facilitation of laser ablation removing much of mold compound. Additional discussion on reliability concerns when evaluating Cu wirebond devices is addressed here. The lack of understanding of the reliability of Cu wire bonded packages creates a challenge to the FA engineer as they must develop techniques to help understanding the reliability issue associated with Cu wire bonding devices. More research and analysis are ongoing to develop appropriate analysis methods and techniques to support the Cu wire bonding device technology in the lab.

scholarly journals Controlling the Facet of ZnO during Wet Chemical Etching Its (0001) O‐Terminated Surface

Small ◽  
2020 ◽  
Vol 16 (51) ◽  
pp. 2007045
Author(s):  
Mei Sun ◽  
Bocheng Yu ◽  
Mengyu Hong ◽  
Zhiwei Li ◽  
Fengjiao Lyu ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Wet Chemical ◽  
Wet Chemical Etching

scholarly journals In Situ Study of the Wet Chemical Etching of SiO2 and Nanoparticle@SiO2 Core–Shell Nanospheres

2021 ◽  
Author(s):  
Albert Grau-Carbonell ◽  
Sina Sadighikia ◽  
Tom A. J. Welling ◽  
Relinde J. A. van Dijk-Moes ◽  
Ramakrishna Kotni ◽  
...  
Keyword(s):  
Chemical Etching ◽  
Core Shell ◽  
In Situ Study ◽  
Wet Chemical ◽  
Wet Chemical Etching
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