Netizens’ Perspective towards Electronic Money and Its Essence in the Virtual Economy: An Empirical Analysis with Special Reference to Delhi-NCR, India

This research attempts to evaluate the ongoing position of the modalities exercised in India concerning digital payments. Largely appraised as a success story in the making, this research examines several instrumental factors in India’s digital payment systems. It further extends to identifying the impact of demographic attributes and constructive variables, such as service quality, reliability, satisfaction, and security on digital payment system, Delhi NCR, India. A Google form questionnaire was adopted to collect data through online mode. The researcher collected the primary data from 165 respondents. Purposive sampling method was exercised, along with CFA technique and parameter test used through SPSS (version 25), reliability issue, validity issue, and model fitness achieve through SPSS-AMOS (version 24). The significant peculiarities and analysis are presented further in this research contributing to a precise depiction of findings and then, based on it, the conclusion.

Research on an invasive and low-frequency power consumption data acquisition method

Aiming at the large-scale, compatibility and reliability problems faced by the data acquisition engineering for power consumption in the industrial field, for reducing the complexity and cost of the data acquisition engineering, and improving the quality, maintainability, scalability and manageability of the data acquisition, an engineering-oriented, intrusive, low-frequency data acquisition scheme for power consumption is proposed. The scheme leverages multi-agent networking technology to solve the large-scale problem, utilizes the communication driver of the dynamic loading adapter mode to tackle the compatibility trouble. Furthermore, the local storage, breakpoint retransmission, flow control, automatic recovery, automatic connection, and time synchronization are combined to solve the reliability issue. Engineering tests show that the proposed scheme possesses the significant backward compatibility characteristics, which can effectively reduce the complexity and cost of data acquisition engineering for power consumption, and significantly improve the quality, maintainability, scalability and manageability of data acquisition.

A Practical Approach to Manage Top-Hole Collision Risk in Crowded Fixed Platform: Implementation in Offshore East Kalimantan

The requirement of drilling in very close proximity to adjacent wells in surface hole section has been common as field become more crowded. This is true especially in offshore mature field where the last wells are drilled on a dense platform. In Santan Field, East Kalimantan, conductor pipes were driven between the existing wells since sidetrack or platform extension options were not available at the time while there are still opportunity for infill and step out wells. This situation introduces challenges on well construction in term of collision avoidance since the spacing between the wells are tight from surface point. The distance between slots is as low 1 meter from center-to-center, and 0.64 meter between wall-to-wall. Directional works was also required at shallow depth to kick of the well as per trajectory requirement. The risk of unplanned intersections with adjacent well can lead to financial loss, personnel safety as well as environmental issue. A comprehensive risk assessment were conducted during the planning phase as the safety of drilling operation has been one of the main concerns. Mitigations plan were then formulated with the objectives to manage the negative consequences to acceptable level. During the planning phase, detail anti-collision procedure was executed to evaluate the collision risk. On the field, several activities were carried out on adjacent wells prior to rig move in as mitigations measure: 1) Rig less resurvey, 2) Well integrity inspection, and 3) Well barrier placement. While drilling, following strategies were performed: 1) GWD utilization, 2) Monitoring on subject and adjacent wells, and 3) Collision-tolerant drilling bit application The all-surface hole were drilled safely without any HSE or reliability issue. No major indications of well collision were observed. However, the drilling time took bit longer than usual performance due to drilling controlled manner for anti-collision precautions. This paper explain how well collision mitigations was implemented in Santan Field, East Kalimantan, which can be a reference for further drilling as a successful case of top-hole drilling on a dense fixed platform. The method is expected to gain economic value, which is notably beneficial in mature field.

Hysteresis in As-Synthesized MoS2 Transistors: Origin and Sensing Perspectives

Two-dimensional materials, including molybdenum disulfide (MoS2), present promising sensing and detecting capabilities thanks to their extreme sensitivity to changes in the environment. Their reduced thickness also facilitates the electrostatic control of the channel and opens the door to flexible electronic applications. However, these materials still exhibit integration difficulties with complementary-MOS standardized processes and methods. The device reliability is compromised by gate insulator selection and the quality of the metal/semiconductor and semiconductor/insulator interfaces. Despite some improvements regarding mobility, hysteresis and Schottky barriers having been reported thanks to metal engineering, vertically stacked heterostructures with compatible thin-layers (such as hexagonal boron nitride or device encapsulation) variability is still an important constraint to sensor performance. In this work, we fabricated and extensively characterized the reliability of as-synthesized back-gated MoS2 transistors. Under atmospheric and room-temperature conditions, these devices present a wide electrical hysteresis (up to 5 volts) in their transfer characteristics. However, their performance is highly influenced by the temperature, light and pressure conditions. The singular signature in the time response of the devices points to adsorbates and contaminants inducing mobile charges and trapping/detrapping carrier phenomena as the mechanisms responsible for time-dependent current degradation. Far from being only a reliability issue, we demonstrated a method to exploit this device response to perform light, temperature and/or pressure sensors in as-synthesized devices. Two orders of magnitude drain current level differences were demonstrated by comparing device operation under light and dark conditions while a factor up to 105 is observed at vacuum versus atmospheric pressure environments.

Underfill Flow in Flip-Chip Encapsulation Process: A Review

The scope of review of this paper focused on the pre-curing underfilling flow stage of encapsulation process. A total of 80 related works has been reviewed and being classified into process type, method employed, and objective attained. Statistically showed that the conventional capillary is the most studied underfill process, while the numerical simulation was mainly adopted. Generally, the analyses on the flow dynamic and distribution of underfill fluids in the bump array aimed for the filling time determination as well as the predictions of void occurrence. Parametric design optimization was subsequently conducted to resolve the productivity issue of long filling time and reliability issue of void occurrence. The bump pitch was found to the most investigated parameter, consistent to the miniaturization demand. To enrich the design versatility and flow visualization aspects, experimental test vehicle was innovated using imitated chip and replacement fluid, or even being scaled-up. Nonetheless, the analytical filling time models became more accurate and sophiscasted over the years, despite still being scarce in number. With the technological advancement on analysis tools and further development of analytic skills, it was believed that the future researches on underfill flow will become more comprehensive, thereby leading to the production of better packages in terms of manufacturing feasibility, performances, and reliability. Lastly, few potential future works were recommended, for instance, microscopic analysis on the bump-fluid interaction, consideration of filler particles and incorporation of artificial intelligence.

Advanced analysis of backsheet failures from 26 power plants

Backsheet degradation is a known reliability issue affecting field-exposed photovoltaic (PV) modules power plants. In this work, we present lessons learned during the last three years, examining modules from 26 power plants in the TestLab PV Modules at Fraunhofer ISE. The basis is a description of the currently observed backsheets and associated degradation features as for example backsheet chalking, cracks in different layers and chemical changes in composition. Furthermore, we lay out analytical methods for initial and more detailed analysis of the failures and module materials. For example, a method designated as “flashlight test” has been found to provide a quick and straightforward method to identify damaged polypropylene (PP) layers within backsheets. Furthermore, scanning acoustic microscopy (SAM) and a comparison of different variants of FTIR spectroscopy are presented.

Memories of Gogol’s Meeting with I. I. Dmitriev in Moscow: Reliability Issue

The well-known reports of T. G. Pashchenko and A. A. Iovsky about I. I. Dmitriev’s meeting with N. V. Gogol in the summer of 1832 in Moscow are considered. An attempt is made to overestimate the text of T. G. Pashchenko’s memoirs, which is considered unreliable, and to show that the information contained there about the first acquaintance of these writers in its main part is consistently combined with the data of other sources that do not raise doubts. It echoes, first of all, with the record of A. A. Iovsky, recently attributed by S. I. Panov, about Gogol’s visit to Dmitriev’s house, as well as with the memoirs of S. T. Aksakov. Memory errors in T. G. Pashchenko’s story can be explained by the temporal remoteness of events and the indirect transmission of information through the retelling of several persons. Separately, it is proposed to consider another significant episode from T. G. Pashchenko’s memoirs — the scene of the author’s reading of the comedy “Marriage”, which supposedly took place at Dmitriev’s. This scene requires new understanding and temporary localization, regardless of I. I. Dmitriev and his meeting with Gogol.

Cascade stress-strength system Reliability Estimation of Inverse Rayleigh Distribution

The electronic devices, equipment and complex machines used in many fields such as telecommunications, medicine, astronautics and others are all subject to malfunctions, which cause material and moral losses, waste of time and other damages. Hence the importance of reliability issue in our working life by evaluating the performance and efficiency of these systems and Measuring the reliability of any device will be the basis for the development of most of these devices . Then In this paper will discussed the Estimation of Reliability Rn for cascade system when the stress and strength are Inverse Rayleigh distributed random variables. under-voltage rating. The cascade system is a redundant component system, which is a redundant component with under-voltage rating and independently distributed power, in which the redundant component replaces the faulty component.. Cascade system is a special case of Stress- Strength models system. Also we discussed the Estimation of Marginal Reliabilities R1, R2 and R3 for Cascade system by three estimation methods (Max. likelihood, Weighted Least Square, Least Square) and Compare between the estimators of R4. © 2018 JASET, International Scholars and Researchers Association