Recent Advances of Conductive Adhesives: A Lead-Free Alternative in Electronic Packaging

2007 ◽  
pp. B611-B627
Author(s):  
Grace Y. Li ◽  
C. P. Wong
Keyword(s):  
Electronic Packaging ◽  
Lead Free ◽  
Conductive Adhesives ◽  
Free Alternative ◽  
Recent Advances

“Turning ceramic on its head” – a polymer based packaging system for operation over 175°C

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000111-000115
Author(s):  
Piers R. Tremlett
Keyword(s):  
High Temperature ◽  
Electronic Packaging ◽  
Lead Free ◽  
Harsh Environment ◽  
Sensor Systems ◽  
Packaging System

A polymer based electronic packaging system has been developed that is capable of operating at temperatures over 175°C and up to 225°C. This system is being developed to be a lead free, non-hermetic and able to deliver miniature or functionally dense circuits. It will be suitable for sensor systems where amplification, signal digitisation and autonomy are important whilst operating in a harsh environment such as high temperature.

Recent Advances and Optoelectronic Applications of Lead‐Free Halide Double Perovskites

2020 ◽  
Vol 26 (71) ◽  
pp. 16975-16984
Author(s):  
Lei Lu ◽  
Xiong Pan ◽  
Junhua Luo ◽  
Zhihua Sun
Keyword(s):  
Lead Free ◽  
Double Perovskites ◽  
Recent Advances ◽  
Optoelectronic Applications
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