“Turning ceramic on its head” – a polymer based packaging system for operation over 175°C

2015 ◽  
Vol 2015 (HiTEN) ◽  
pp. 000111-000115
Author(s):  
Piers R. Tremlett
Keyword(s):  
High Temperature ◽  
Electronic Packaging ◽  
Lead Free ◽  
Harsh Environment ◽  
Sensor Systems ◽  
Packaging System

A polymer based electronic packaging system has been developed that is capable of operating at temperatures over 175°C and up to 225°C. This system is being developed to be a lead free, non-hermetic and able to deliver miniature or functionally dense circuits. It will be suitable for sensor systems where amplification, signal digitisation and autonomy are important whilst operating in a harsh environment such as high temperature.

Development and Testing of Harsh Environment, Wireless Sensor Systems for Industrial Gas Turbines

2009 ◽  
Author(s):  
David Mitchell ◽  
Anand Kulkarni ◽  
Alex Lostetter ◽  
Marcelo Schupbach ◽  
John Fraley ◽  
...  
Keyword(s):  
High Temperature ◽  
Gas Turbine ◽  
Gas Turbines ◽  
Turbine Blades ◽  
Operating Conditions ◽  
Condition Based Maintenance ◽  
Harsh Environment ◽  
Sensor Systems ◽  
Wireless Telemetry ◽  
Industrial Gas Turbines

The potential for savings provided to worldwide operators of industrial gas turbines, by transitioning from the current standard of interval-based maintenance to condition-based maintenance may be in the hundreds of millions of dollars. In addition, the operational flexibility that may be obtained by knowing the historical and current condition of life-limiting components will enable more efficient use of industrial gas turbine resources, with less risk of unplanned outages as a result of off-parameter operations. To date, it has been impossible to apply true condition-based maintenance to industrial gas turbines because the extremely harsh operating conditions in the heart of a gas turbine preclude using the necessary advanced sensor systems to monitor the machine’s condition continuously. Siemens, Rove Technical Services, and Arkansas Power Electronics International are working together to develop a potentially industry-changing technology to build smart, self-aware engine components that incorporate embedded, harsh-environment-capable sensors and high temperature capable wireless telemetry systems for continuously monitoring component condition in the hot gas path turbine sections. The approach involves embedding sensors on complex shapes, such as turbine blades, embedding wireless telemetry systems in regions with temperatures that preclude the use of conventional silicon-based electronics, and successfully transmitting the sensor information from an environment very hostile to wireless signals. The results presented will include those from advanced, harsh environment sensor and wireless telemetry component development activities. In addition, results from laboratory and high temperature rig and spin testing will be discussed.

Shear Strength and Dsc Analysis of High-Temperature Solders

2013 ◽  
Vol 58 (2) ◽  
pp. 529-533 ◽  
Author(s):  
R. Koleňák ◽  
M. Martinkovič ◽  
M. Koleňáková
Keyword(s):  
Shear Strength ◽  
High Temperature ◽  
Lead Free ◽  
Dsc Analysis ◽  
Ultrasonic Activation ◽  
Metallic Substrates ◽  
Cu Substrate ◽  
Lead Free Solders

The work is devoted to the study of shear strength of soldered joints fabricated by use of high-temperature solders of types Bi-11Ag, Au-20Sn, Sn-5Sb, Zn-4Al, Pb-5Sn, and Pb-10Sn. The shear strength was determined on metallic substrates made of Cu, Ni, and Ag. The strength of joints fabricated by use of flux and that of joints fabricated by use of ultrasonic activation without flux was compared. The obtained results have shown that in case of soldering by use of ultrasound (UT), higher shear strength of soldered joints was achieved with most solders. The highest shear strength by use of UT was achieved with an Au-20Sn joint fabricated on copper, namely up to 195 MPa. The lowest average values were achieved with Pb-based solders (Pb-5Sn and Pb-10Sn). The shear strength values of these solders used on Cu substrate varied from 24 to 27 MPa. DSC analysis was performed to determine the melting interval of lead-free solders.

scholarly journals Langasite Based Surface Acoustic Wave Sensors for High Temperature Chemical Detection in Harsh Environment

2009 ◽  
Vol 1 (1) ◽  
pp. 963-966 ◽  
Author(s):  
G. Tortissier ◽  
L. Blanc ◽  
A. Tetelin ◽  
J-L. Lachaud ◽  
M. Benoit ◽  
...  
Keyword(s):  
High Temperature ◽  
Acoustic Wave ◽  
Surface Acoustic Wave ◽  
Harsh Environment ◽  
Chemical Detection ◽  
Acoustic Wave Sensors ◽  
Wave Sensors

scholarly journals Impact of temperature on Bacillus cereus spore germination in ultra-high temperature chocolate milk

Food Research ◽  
2019 ◽  
pp. 808-813
Author(s):  
Ubong A. ◽  
C.Y. New ◽  
L.C. Chai ◽  
Nur Fatihah A. ◽  
Nur Hasria K. ◽  
...  
Keyword(s):  
High Temperature ◽  
Bacillus Cereus ◽  
Incubation Time ◽  
Spore Germination ◽  
Infection Risk ◽  
Effect Of Temperature ◽  
Harsh Environment ◽  
Chocolate Milk ◽  
Data Gap ◽  
Germination And Growth

Bacillus cereus spores are capable of surviving the harsh environment and more often, they cause great concern to the dairy industry. The current research was conducted to study the effect of temperature on germination and growth of B. cereus spores in UHT chocolate milk; the study was carried out at 8°C, 25°C and 35°C over a span of seven days. The results showed that no growth was observed at 8°C. At 25°C, a rapid increase in growth was observed as early as Day 1, from an initial count of ten spores to 4.01 log10 CFU/mL. Meanwhile, at 35°C, the growth on Day 1 was more rapid in which the count promptly increased to 8.07 log10 CFU/mL. Analysis of graph trend showed that the number of vegetative cells decreased while the number of spores increased with incubation time due to nutrients exhaustion. This study fills up the data gap towards understanding the possible issues that might arise in the actual scenario and at the same time, suggests a suitable approach to minimize infection risk caused by B. cereus spores.

scholarly journals Reliability of High Temperature and Vibration in Sn3.5Ag and Sn0.7Cu Lead-free Solders

2012 ◽  
Vol 19 (3) ◽  
pp. 31-36 ◽  
Author(s):  
Yong-Ho Ko ◽  
Taek-Soo Kim ◽  
Young-Kyu Lee ◽  
Sehoo Yoo ◽  
Chang-Woo Lee
Keyword(s):  
High Temperature ◽  
Lead Free ◽  
Lead Free Solders

scholarly journals 09 - Silicon Carbide Sensor Systems for Harsh Environment Market Applications

2015 ◽  
Author(s):  
M. Andersson ◽  
B. Hammarlund ◽  
A. Lloyd Spetz ◽  
D. Puglisi
Keyword(s):  
Silicon Carbide ◽  
Harsh Environment ◽  
Sensor Systems

Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

2012 ◽  
Vol 21 (5) ◽  
pp. 629-637 ◽  
Author(s):  
Ales Kroupa ◽  
Dag Andersson ◽  
Nick Hoo ◽  
Jeremy Pearce ◽  
Andrew Watson ◽  
...  
Keyword(s):  
High Temperature ◽  
Lead Free
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