An Entropy Based Group Setup Strategy for PCB Assembly

Author(s):  
In-Jae Jeong
Keyword(s):  
1995 ◽  
Vol 8 (6) ◽  
pp. 448-456 ◽  
Author(s):  
YI-CHEN SU ◽  
COLLIN WANG ◽  
PIUS J. EGBELU ◽  
DAVID J. CANNON
Keyword(s):  

2002 ◽  
Vol 124 (3) ◽  
pp. 205-211 ◽  
Author(s):  
John H. Lau ◽  
S. W. Ricky Lee ◽  
Stephen H. Pan ◽  
Chris Chang

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.


IEEE Access ◽  
2019 ◽  
Vol 7 ◽  
pp. 18685-18700 ◽  
Author(s):  
Jabir Mumtaz ◽  
Zailin Guan ◽  
Lei Yue ◽  
Zhengya Wang ◽  
Saif Ullah ◽  
...  

1999 ◽  
Vol 10 (5) ◽  
pp. 256-265 ◽  
Author(s):  
Nan‐Shing Ong ◽  
Li Pheng Khoo

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