Optimizing feeder arrangement of a PCB assembly machine for multiple boards

The component placement sequence and feeder arrangement are two critical factors determining the assembly time of chip-shooter machine (CS). In addition, the different size of component and different arrangement strategy affect the feeder arrangement and component placement sequence. Based on the engineering analysis, an integrated optimization model of printed circuit board (PCB) assembly for CS machine is established. According to the parallel placement character of CS machine, "Max-Min Ant Colony Algorithm with Communication function (MMAC)" is designed based on traditional Ant Colony Algorithm. The idea that two ants with different duties collaborate to solve the optimization problem is presented. Guide ants optimize placement sequence while executant ants optimize feeder arrangement according to the components placement sequence. The component placement sequence and feeder arrangement are optimized simultaneously

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An optimization algorithm of PCB assembly time for multi-head placement machine

2017 36th Chinese Control Conference (CCC) ◽

10.23919/chicc.2017.8027802 ◽

2017 ◽

Author(s):

Haiming Liu ◽

Peng Yuan ◽

Jiaxiang Luo ◽

Mei Zhang

Keyword(s):

Optimization Algorithm ◽

Assembly Time ◽

Pcb Assembly ◽

Placement Machine

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A knowledge-based object oriented DFM advisor for surface mount PCB assembly

The International Journal of Advanced Manufacturing Technology ◽

10.1007/bf01178985 ◽

1995 ◽

Vol 10 (5) ◽

pp. 317-329 ◽

Cited By ~ 8

Author(s):

S. Krishnan ◽

K. Srihari

Keyword(s):

Object Oriented ◽

Surface Mount ◽

Pcb Assembly ◽

Knowledge Based

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A dynamic point specification approach to sequencing robot moves for PCB assembly

International Journal of Computer Integrated Manufacturing ◽

10.1080/09511929508944672 ◽

1995 ◽

Vol 8 (6) ◽

pp. 448-456 ◽

Cited By ~ 20

Author(s):

YI-CHEN SU ◽

COLLIN WANG ◽

PIUS J. EGBELU ◽

DAVID J. CANNON

Keyword(s):

Pcb Assembly

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Nonlinear-Time-Dependent Analysis of Micro Via-In-Pad Substrates for Solder Bumped Flip Chip Applications

Journal of Electronic Packaging ◽

10.1115/1.1462626 ◽

2002 ◽

Vol 124 (3) ◽

pp. 205-211 ◽

Cited By ~ 12

Author(s):

John H. Lau ◽

S. W. Ricky Lee ◽

Stephen H. Pan ◽

Chris Chang

Keyword(s):

Cross Sections ◽

Flip Chip ◽

Printed Circuit Board ◽

Low Cost ◽

Circuit Board ◽

Test Results ◽

Pcb Assembly ◽

Creep Analysis ◽

Chip Scale Package ◽

Time Dependent Analysis

An elasto-plastic-creep analysis of a low-cost micro via-in-pad (VIP) substrate for supporting a solder bumped flip chip in a chip scale package (CSP) format which is soldered onto a printed circuit board (PCB) is presented in this study. Emphasis is placed on the design, materials, and reliability of the micro VIP substrate and of the micro VIP CSP solder joints on PCB. The solder is assumed to obey Norton’s creep law. Cross-sections of samples are examined for a better understanding of the solder bump, CSP substrate redistribution, micro VIP, and solder joint. Also, the thermal cycling test results of the micro VIP CSP PCB assembly is presented.

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