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Challenges of Power Electronic Packaging
Power Electronic Packaging
◽
10.1007/978-1-4614-1053-9_1
◽
2011
◽
pp. 1-8
◽
Cited By ~ 1
Author(s):
Yong Liu
Keyword(s):
Electronic Packaging
◽
Power Electronic
Download Full-text
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Cited By
References
Failure modes and FEM analysis of power electronic packaging
Finite Elements in Analysis and Design
◽
10.1016/s0168-874x(01)00094-4
◽
2002
◽
Vol 38
(7)
◽
pp. 601-612
◽
Cited By ~ 96
Author(s):
Hua Ye
◽
Minghui Lin
◽
Cemal Basaran
Keyword(s):
Electronic Packaging
◽
Failure Modes
◽
Fem Analysis
◽
Power Electronic
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Advanced multiphysics simulation for high performance power electronic packaging design
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
◽
10.1109/3dpeim.2016.7570563
◽
2016
◽
Cited By ~ 2
Author(s):
Xin Zhao
◽
Yang Xu
◽
Douglas C. Hopkins
Keyword(s):
Electronic Packaging
◽
High Performance
◽
Power Electronic
◽
Multiphysics Simulation
◽
Packaging Design
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Advanced multi-physics simulation for high performance power electronic packaging design
2016 International Symposium on 3D Power Electronics Integration and Manufacturing (3D-PEIM)
◽
10.1109/3dpeim.2016.8048203
◽
2016
◽
Author(s):
Xin Zhao
◽
Yang Xu
◽
Douglas C. Hopkins
Keyword(s):
Electronic Packaging
◽
High Performance
◽
Power Electronic
◽
Packaging Design
◽
Physics Simulation
Download Full-text
Overview of Digital Design and Finite-Element Analysis in Modern Power Electronic Packaging
IEEE Transactions on Power Electronics
◽
10.1109/tpel.2020.2978584
◽
2020
◽
Vol 35
(10)
◽
pp. 10892-10905
◽
Cited By ~ 1
Author(s):
Asger Bjorn Jorgensen
◽
Stig Munk-Nielsen
◽
Christian Uhrenfeldt
Keyword(s):
Finite Element Analysis
◽
Finite Element
◽
Electronic Packaging
◽
Digital Design
◽
Power Electronic
◽
Element Analysis
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Trends of Power Electronic Packaging and Modeling
2008 10th Electronics Packaging Technology Conference
◽
10.1109/eptc.2008.4763404
◽
2008
◽
Cited By ~ 17
Author(s):
Yong Liu
◽
Scott Irving
◽
Timwah Luk
◽
Dan Kinzer
Keyword(s):
Electronic Packaging
◽
Power Electronic
Download Full-text
Electrochemical migration of sintered nanosilver under chloride-containing thin electrolyte layer for power electronic packaging
CORROSION
◽
10.5006/1909
◽
2015
◽
Author(s):
Yana Zheng
◽
Yunhui Mei
◽
Chaoyi Yan
◽
Guo-Quan Lu
Keyword(s):
Electronic Packaging
◽
Electrochemical Migration
◽
Power Electronic
◽
Electrolyte Layer
◽
Thin Electrolyte Layer
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Bonding 1200 V, 150 A IGBT chips (13.5 mm × 13.5 mm) with DBC substrate by pressureless sintering nanosilver paste for power electronic packaging
2014 15th International Conference on Electronic Packaging Technology
◽
10.1109/icept.2014.6922606
◽
2014
◽
Cited By ~ 4
Author(s):
Shancan Fu
◽
Yunhui Mei
◽
Xin Li
◽
Guo-Quan Lu
Keyword(s):
Electronic Packaging
◽
Pressureless Sintering
◽
Power Electronic
◽
Nanosilver Paste
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Partial discharge behaviour of power electronic packaging insulation
Proceedings of 1998 International Symposium on Electrical Insulating Materials. 1998 Asian International Conference on Dielectrics and Electrical Insulation. 30th Symposium on Electrical Insulating Materials (IEEE Cat. No.98TH8286)
◽
10.1109/iseim.1998.741806
◽
2002
◽
Cited By ~ 14
Author(s):
M. Berth
Keyword(s):
Electronic Packaging
◽
Partial Discharge
◽
Power Electronic
◽
Discharge Behaviour
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Sintering Mechanism of a Supersaturated Ag–Cu Nanoalloy Film for Power Electronic Packaging
ACS Applied Materials & Interfaces
◽
10.1021/acsami.9b20731
◽
2020
◽
Vol 12
(14)
◽
pp. 16743-16752
Author(s):
Qiang Jia
◽
Guisheng Zou
◽
Wengan Wang
◽
Hui Ren
◽
Hongqiang Zhang
◽
...
Keyword(s):
Electronic Packaging
◽
Power Electronic
◽
Sintering Mechanism
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An improved way to measure thermal impedance of insulated gate bipolar transistor (IGBT) module for power electronic packaging
2013 14th International Conference on Electronic Packaging Technology
◽
10.1109/icept.2013.6756601
◽
2013
◽
Cited By ~ 3
Author(s):
Guo-Quan Lu
◽
Meiyu Wang
◽
Yunhui Mei
◽
Xin Li
◽
Lei Wang
◽
...
Keyword(s):
Electronic Packaging
◽
Bipolar Transistor
◽
Power Electronic
◽
Thermal Impedance
◽
Insulated Gate Bipolar Transistor
◽
Igbt Module
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