Power Electronic Packaging
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TOTAL DOCUMENTS

12

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1

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Published By Springer New York

9781461410522, 9781461410539

Latest Documents Most Cited Documents Contributed Authors Related Sources Related Keywords

Power IC Package Design and Analysis

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_4 ◽

2011 ◽

pp. 57-88

Author(s):

Yong Liu

Keyword(s):

Package Design ◽

Power Ic ◽

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Power Package Thermal and Mechanical Codesign Simulation Automation

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_11 ◽

2011 ◽

pp. 465-515

Author(s):

Yong Liu

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Discrete Power MOSFET Package Design and Analysis

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_3 ◽

2011 ◽

pp. 27-56

Author(s):

Yong Liu

Keyword(s):

Power Mosfet ◽

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Material Characterization for Power Electronics Packaging

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_7 ◽

2011 ◽

pp. 215-282

Author(s):

Yong Liu

Keyword(s):

Power Electronics ◽

Material Characterization ◽

Electronics Packaging

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Thermal Management, Design, and Cooling for Power Electronics

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_6 ◽

2011 ◽

pp. 167-213

Author(s):

Yong Liu

Keyword(s):

Power Electronics ◽

Thermal Management

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Power Package Electrical Isolation Design

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_2 ◽

2011 ◽

pp. 9-26

Author(s):

Yong Liu

Keyword(s):

Electrical Isolation

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Power Package Typical Assembly Process

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_8 ◽

2011 ◽

pp. 283-344

Author(s):

Yong Liu

Keyword(s):

Assembly Process

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Power Packaging Typical Reliability and Test

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_9 ◽

2011 ◽

pp. 345-425

Author(s):

Yong Liu

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Challenges of Power Electronic Packaging

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_1 ◽

2011 ◽

pp. 1-8 ◽

Author(s):

Yong Liu

Keyword(s):

Electronic Packaging ◽

Power Electronic

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Power Module/SiP/3D/Stack/Embedded Packaging Design and Considerations

Power Electronic Packaging ◽

10.1007/978-1-4614-1053-9_5 ◽

2011 ◽

pp. 89-166

Author(s):

Yong Liu

Keyword(s):

Power Module ◽

Packaging Design

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