Prediction of Delayed Fracture from Crack Coalescence — Alumina

1986 ◽  
pp. 297-310 ◽  
Author(s):  
Tatsuo Okada ◽  
George Sines
Author(s):  
Prabjit Singh ◽  
Ying Yu ◽  
Robert E. Davis

Abstract A land-grid array connector, electrically connecting an array of plated contact pads on a ceramic substrate chip carrier to plated contact pads on a printed circuit board (PCB), failed in a year after assembly due to time-delayed fracture of multiple C-shaped spring connectors. The land-grid-array connectors analyzed had arrays of connectors consisting of gold on nickel plated Be-Cu C-shaped springs in compression that made electrical connections between the pads on the ceramic substrates and the PCBs. Metallography, fractography and surface analyses revealed the root cause of the C-spring connector fracture to be plating solutions trapped in deep grain boundary grooves etched into the C-spring connectors during the pre-plating cleaning operation. The stress necessary for the stress corrosion cracking mechanism was provided by the C-spring connectors, in the land-grid array, being compressed between the ceramic substrate and the printed circuit board.


2011 ◽  
Vol 257 (19) ◽  
pp. 8275-8281 ◽  
Author(s):  
Eiji Akiyama ◽  
Katsuhiro Matsukado ◽  
Songjie Li ◽  
Kaneaki Tsuzaki

2007 ◽  
Vol 22 (1) ◽  
pp. 136-139 ◽  
Author(s):  
Byung-Woo Min ◽  
Kwang-Soon Song ◽  
Chul-Hyung Kang ◽  
Ki-Cheol Bae ◽  
Ye-Yeon Won ◽  
...  

2016 ◽  
Vol 49 (10) ◽  
pp. 3983-3998 ◽  
Author(s):  
Chao Jiang ◽  
Gao-Feng Zhao ◽  
Jianbo Zhu ◽  
Yi-Xin Zhao ◽  
Luming Shen

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