An Electrostatic Description of Chemical Binding

1980 ◽  
pp. 47-62 ◽  
Author(s):  
F. L. Hirshfeld
Keyword(s):  
Chemical Binding

The Effect of Odor and Color on Chemical Cooling

2019 ◽  
Author(s):  
Robert Pellegrino ◽  
Curtis Luckett
Keyword(s):  
Primary Component ◽  
Magnitude Scale ◽  
Trigeminal System ◽  
Abstract Concepts ◽  
Specific Chemical ◽  
Chemical Binding ◽  
Cooling Intensity ◽  
Crossmodal Associations ◽  
First Session

Chemesthesis, along with taste and olfaction, is a primary component of flavor that engages the trigeminal system through specific chemical binding. For instance, many gums or confectionaries incorporate chemical cooling agents, such as Wilkinson Sword (WS) compounds, to create the sensation of coldness. The current study was designed to evaluate crossmodal associations of color and aroma with the chemesthetic perception of cooling. A “minty” and non-odorized set of confectionary stimuli, colored green, blue or white, with moderate cooling properties (with WS-3) were used in this study. In the first session, participants were randomly presented a stimuli and asked to rate several attributes including its cooling intensity on a generalized Labeled Magnitude Scale (gLMS). In the second session, the same participants were asked to relate cooling levels to different colors and which color relates to the “minty” odor. Additionally, open-ended reasons were given for association choices. Appearance and odor influenced the intensity of cooling sensation. In particular, the odorized and blue samples were rated as cooler than the non-odorized and other colored samples, respectively. The follow-up session confirms blue as a color associated with cooling properties, especially cool objects/abstract concepts. Meanwhile, odor’s enhancement on cooling sensation may be more perceptual in nature through affective matching from enhanced flavor.

scholarly journals Valence Force Constants of Carbonyl Bonds in Naphthaldehydic Compounds as Chemical Binding Correlation Parameters

1985 ◽  
Vol 40 (9) ◽  
pp. 927-931
Author(s):  
Victor Vargas ◽  
Ernesto Clavijo ◽  
Raul G. E. Morales
Keyword(s):  
Force Constants ◽  
Chemical Binding ◽  
Valence Force ◽  
Correlation Parameters

Small-angle electron scattering by formaldehyde and ketene: Effects of electron correlation and chemical binding

1992 ◽  
Vol 43 (5) ◽  
pp. 701-712 ◽  
Author(s):  
Yorihiko Sasaki ◽  
Hiroshi Takeuchi ◽  
Shigehiro Konaka ◽  
Masao Kimura
Keyword(s):  
Electron Scattering ◽  
Small Angle ◽  
Electron Correlation ◽  
Chemical Binding

Reversibly Altering Electronic Conduction through a Single Molecule by a Chemical Binding Event

2003 ◽  
Vol 107 (45) ◽  
pp. 12378-12382 ◽  
Author(s):  
Bala Sundari T. Kasibhatla ◽  
André P. Labonté ◽  
Ferdows Zahid ◽  
Ronald G. Reifenberger ◽  
Supriyo Datta ◽  
...  
Keyword(s):  
Single Molecule ◽  
Electronic Conduction ◽  
Chemical Binding ◽  
Binding Event

Electronic Structure and Chemical Binding. By O. K. Rice.

1940 ◽  
Vol 44 (9) ◽  
pp. 1148-1149
Author(s):  
Geo. Glockler
Keyword(s):  
Electronic Structure ◽  
Chemical Binding

Interfacial Adhesion of Cu to Self-Assembled Monolayers on SiO2

2001 ◽  
Vol 695 ◽  
Author(s):  
G. Cui ◽  
M. Lane ◽  
K. Vijayamohanan ◽  
G. Ramanath
Keyword(s):  
Binding Energy ◽  
Photoelectron Spectroscopy ◽  
Interfacial Adhesion ◽  
Adhesion Energy ◽  
Binding Energies ◽  
Self Assembled Monolayers ◽  
Chemical Binding ◽  
Barrier Materials ◽  
Assembled Monolayers ◽  
Self Assembled

ABSTRACTAs the critical feature size in microelectronic devices continues to decrease below 100 nm, new barrier materials of > 5 nm thickness are required. Recently we have shown that self-assembled monolayers (SAMs) are attractive candidates that inhibit Cu diffusion into SiO2. For SAMs to be used as barriers in real applications, however, they must also promote adhesion at the Cu/dielectric interfaces. Here, we report preliminary quantitative measurements of interfacial adhesion energy and chemical binding energy of Cu/SiO2 interfaces treated with nitrogen-terminated SAMs. Amine-containing SAMs show a ~10% higher adhesion energy with Cu, while interfaces with Cu-pyridine bonds actually show degraded adhesion, when compared with that of the reference Cu/SiN interface. However, X-ray photoelectron spectroscopy (XPS) measurements show that Cu-pyridine and Cu-amine interactions have a factor-of-four higher binding energy than that of Cu-N bonds at Cu/SiN interfaces. The lack of correlation between adhesion and chemical binding energies is most likely due to incomplete coverage of SAMs.

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