Solving for Thermal History and Metallurgical Condition of a Quenched and Aged Aluminum Alloy through Conductivity and Hardness Properties

1984 ◽  
pp. 81-88 ◽  
Author(s):  
Russell A. Chihoski
Keyword(s):  
Aluminum Alloy ◽  
Thermal History

Effect of thermal history on the tensile strength of a friction stir welded aluminum alloy

2018 ◽  
Vol 60 (12) ◽  
pp. 1184-1190
Author(s):  
Muthunadar Selvaraj ◽  
Koteswara Rao ◽  
Gurusamy Selvakumar ◽  
Vela Murali
Keyword(s):  
Tensile Strength ◽  
Aluminum Alloy ◽  
Thermal History ◽  
Friction Stir

Techniques for Transmission Electron Microscopy of Fiber-Matrix Interfaces in Aluminum Alloy-Boron Composites by Ion Erosio

1971 ◽  
Vol 29 ◽  
pp. 204-205
Author(s):  
G. G. Shaw
Keyword(s):  
Electron Microscopy ◽  
Transmission Electron Microscopy ◽  
Aluminum Alloy ◽  
Electron Beam ◽  
Pure Aluminum ◽  
Ion Milling ◽  
Transmission Electron ◽  
Fiber Matrix ◽  
Ion Erosion ◽  
Row Of Fibers

The morphology and composition of the fiber-matrix interface can best be studied by transmission electron microscopy and electron diffraction. For some composites satisfactory samples can be prepared by electropolishing. For others such as aluminum alloy-boron composites ion erosion is necessary.When one wishes to examine a specimen with the electron beam perpendicular to the fiber, preparation is as follows: A 1/8 in. disk is cut from the sample with a cylindrical tool by spark machining. Thin slices, 5 mils thick, containing one row of fibers, are then, spark-machined from the disk. After spark machining, the slice is carefully polished with diamond paste until the row of fibers is exposed on each side, as shown in Figure 1.In the case where examination is desired with the electron beam parallel to the fiber, preparation is as follows: Experimental composites are usually 50 mils or less in thickness so an auxiliary holder is necessary during ion milling and for easy transfer to the electron microscope. This holder is pure aluminum sheet, 3 mils thick.

Analytical electron microscopy of grain boundaries in Al-Cu metallizations

1992 ◽  
Vol 50 (2) ◽  
pp. 1684-1685
Author(s):  
J. R. Michael ◽  
A. D. Romig ◽  
D. R. Frear
Keyword(s):  
Electron Microscopy ◽  
Integrated Circuits ◽  
Failure Mode ◽  
Current Density ◽  
Thermal History ◽  
Analytical Electron Microscopy ◽  
Cu Metallization ◽  
Analytical Electron ◽  
Interconnect Lines

Al with additions of Cu is commonly used as the conductor metallizations for integrated circuits, the Cu being added since it improves resistance to electromigration failure. As linewidths decrease to submicrometer dimensions, the current density carried by the interconnect increases dramatically and the probability of electromigration failure increases. To increase the robustness of the interconnect lines to this failure mode, an understanding of the mechanism by which Cu improves resistance to electromigration is needed. A number of theories have been proposed to account for role of Cu on electromigration behavior and many of the theories are dependent of the elemental Cu distribution in the interconnect line. However, there is an incomplete understanding of the distribution of Cu within the Al interconnect as a function of thermal history. In order to understand the role of Cu in reducing electromigration failures better, it is important to characterize the Cu distribution within the microstructure of the Al-Cu metallization.

Effect of Sealing Treatments on the Corrosion Behavior of Micro-arc Oxidation Coating on Aluminum Alloy in Acid NaCl Solution

2015 ◽  
Vol 30 (6) ◽  
pp. 627
Author(s):  
YE Zuo-Yan ◽  
LIU Dao-Xin ◽  
LI Chong-Yang ◽  
ZHANG Xiao-Hua ◽  
ZANG Xiao-Ming ◽  
...  
Keyword(s):  
Aluminum Alloy ◽  
Corrosion Behavior ◽  
Nacl Solution ◽  
Micro Arc Oxidation

THERMAL ANALYSIS USING INVERSE TECHNIQUE APPLIED TO AN ALUMINUM ALLOY GTAW

Equipment ◽  
2006 ◽  
Author(s):  
S. R. Carvalho ◽  
S. M. M. Lima e Silva ◽  
G. Guimaraes
Keyword(s):  
Thermal Analysis ◽  
Aluminum Alloy ◽  
Inverse Technique
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