Novel Technique for Quantitative Measurement of Localized Stresses Near Dislocation Channel—Grain Boundary Interaction Sites in Irradiated Stainless Steel

2017 ◽  
pp. 2221-2229
Author(s):  
D. C. Johnson ◽  
G. S. Was
Keyword(s):  
Stainless Steel ◽  
Grain Boundary ◽  
Quantitative Measurement ◽  
Interaction Sites ◽  
Novel Technique ◽  
Boundary Interaction

TEM study of dislocation array/high angle grain boundary interaction in type 304 stainless steel

1986 ◽  
Vol 44 ◽  
pp. 586-587
Author(s):  
Cynthia M. Wise
Keyword(s):  
Mechanical Properties ◽  
Stainless Steel ◽  
Grain Boundary ◽  
304 Stainless Steel ◽  
High Angle ◽  
Boundary Interaction ◽  
Solution Treated ◽  
Type 304 ◽  
Type 304 Stainless Steel ◽  
Standard Techniques

The interaction of dislocations with grain boundaries is considered a controlling process for many of the mechanical properties, including strength in a metal. The grain boundary acts as a barrier to impede the motion of dislocations, and strengthens the material because of the increased stress necessary to induce slip propagation.TEM samples were prepared from type 304 stainless steel which was solution treated, lightly deformed, electropolished using standard techniques, and examined in a JEOL 200CX TEM operating at 200KeV, using a double-tilt goniometer stage.

Electrostatic Adhesion Testing for the Evaluation of Metallization Adhesion

1997 ◽  
Vol 473 ◽  
Author(s):  
H. S. Yang ◽  
F. R. Brotzen ◽  
D. L. Callahan ◽  
C. F. Dunn
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Distribution Function ◽  
Quantitative Measurement ◽  
Multilayer Films ◽  
Adhesion Testing ◽  
Novel Technique ◽  
Electrostatic Adhesion ◽  
Scanning Electron

ABSTRACTQuantitative measurement of the adhesion strength of thin film metallizations has been achieved by a novel technique employing electrostatic forces to generate delaminating stresses. This technique has been used in testing the adhesion of Al-Cu, Cu, and Al multilayer films deposited on Si. Micro-blister-type failure is revealed by scanning electron microscopy. The delamination process and the geometry of the blister are discussed. The measured adhesion data fit a Weibull distribution function.

Studies on grain boundary effects in spray deposited BICOVOX 0.1 films on platinum-coated stainless steel substrate

Ionics ◽  
2010 ◽  
Vol 17 (1) ◽  
pp. 69-74 ◽  
Author(s):  
Rajeev Joshi ◽  
Ratikant Mishra ◽  
C. A. Betty ◽  
Shilpa Sawant ◽  
S. H. Pawar
Keyword(s):  
Stainless Steel ◽  
Grain Boundary ◽  
Stainless Steel Substrate ◽  
Steel Substrate ◽  
Boundary Effects ◽  
Grain Boundary Effects

Arrest of weld-decay in 304 austenitic stainless steel by twin-induced grain boundary engineering

2007 ◽  
Vol 55 (16) ◽  
pp. 5401-5407 ◽  
Author(s):  
H. Kokawa ◽  
M. Shimada ◽  
M. Michiuchi ◽  
Z.J. Wang ◽  
Y.S. Sato
Keyword(s):  
Stainless Steel ◽  
Austenitic Stainless Steel ◽  
Grain Boundary ◽  
Grain Boundary Engineering ◽  
304 Austenitic Stainless Steel
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