Electrostatic Adhesion Testing for the Evaluation of Metallization Adhesion

1997 ◽  
Vol 473 ◽  
Author(s):  
H. S. Yang ◽  
F. R. Brotzen ◽  
D. L. Callahan ◽  
C. F. Dunn
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Distribution Function ◽  
Quantitative Measurement ◽  
Multilayer Films ◽  
Adhesion Testing ◽  
Novel Technique ◽  
Electrostatic Adhesion ◽  
Scanning Electron

ABSTRACTQuantitative measurement of the adhesion strength of thin film metallizations has been achieved by a novel technique employing electrostatic forces to generate delaminating stresses. This technique has been used in testing the adhesion of Al-Cu, Cu, and Al multilayer films deposited on Si. Micro-blister-type failure is revealed by scanning electron microscopy. The delamination process and the geometry of the blister are discussed. The measured adhesion data fit a Weibull distribution function.

scholarly journals KARAKTERISASI KAPASITOR BARIUM STRONTIUM TITANAT (BST) Ba0,75 Sr0,25 TiO3 , YANG DIBUAT MENGGUNAKAN METODE SOL-GEL

2019 ◽  
Vol 16 (1) ◽  
pp. 65
Author(s):  
Rahmi Dewi ◽  
Tiara Pertiwi ◽  
Krisman Krisman
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Dielectric Constant ◽  
Impedance Spectroscopy ◽  
Strontium Titanate ◽  
Barium Strontium Titanate ◽  
Sol Gel ◽  
Barium Strontium ◽  
Scanning Electron

The thin film of Barium Strontium Titanate (BST) has been studied withcomposition ofby using sol-gel method that annealed in temperature of 600oC and 650oC. The thin film of BST is characterized by using Field Emission Scanning Electron Microscopy (FESEM) and an impedance spectroscopy. The results of  FESEM characterization for samples in temperature of 600oC and 650oC are 55.83 nm and 84.88 nm in thickness respectively. The result of impedance spectroscopy characterization given frequency values obtained by the impedance value of real and imaginary.The capacitance value at a frequency of 20 Hz from a thin film of BST in temperature of 600oC and 650oC are 69.36Fand138.70F. The dielectric constant of the thin film of BST in temperature of 600oC and 650oC are 22.17 dan 131.56 respectively.

Synthesis and Film Investigation of Titania

2013 ◽  
Vol 832 ◽  
pp. 128-131
Author(s):  
Sharipah Nadzirah ◽  
Uda Hashim
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Thin Films ◽  
Scanning Electron Microscopy ◽  
Titanium Dioxide ◽  
Sol Gel ◽  
Titanium Butoxide ◽  
Before And After ◽  
Scanning Electron ◽  
Spin Coater

Titania or titanium dioxide (TiO2) thin film has been synthesized via sol-gel method with monoethanolamine (MEA) as a catalyst. The mixing of titanium butoxide as a precursor, ethanol as a solvent and MEA were stirred using magnetic stirrer under ambient temperature [. The TiO2solution prepared then was deposited on SiO2substrates using spin-coater and the coated films were annealed at 600°C. Finally, both before and after annealed TiO2thin films were characterized using Field Emission Scanning Electron Microscopy (FESEM). The obtained results show the different TiO2particles formation before and after annealed.

Charge dynamics in aluminum oxide thin film studied by ultrafast scanning electron microscopy

2018 ◽  
Vol 187 ◽  
pp. 93-97 ◽  
Author(s):  
Maurizio Zani ◽  
Vittorio Sala ◽  
Gabriele Irde ◽  
Silvia Maria Pietralunga ◽  
Cristian Manzoni ◽  
...  
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Aluminum Oxide ◽  
Oxide Thin Film ◽  
Charge Dynamics ◽  
Scanning Electron

Approaches to Solution Deposited Flexible Composite Vapor Barrier Films

2009 ◽  
Vol 1195 ◽  
Author(s):  
Jeffrey A. Gerbec ◽  
Jimmy Granstrom ◽  
Hunaid Nulwala ◽  
Luis M. Campos ◽  
Craig Hawker
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Compressive Stress ◽  
Interfacial Adhesion ◽  
Ambient Pressure ◽  
Silica Sol ◽  
Multilayered Structures ◽  
Barrier Films ◽  
Scanning Electron

AbstractLiquid resin hybridized silica sol-gels and thiol-ene elastomers were evaluated as compatible materials to form thin film, flexible multilayered structures. Liquid resins are cast and cured in air and ambient pressure on the order of minutes. Scanning Electron Microscopy (SEM) reveals homogeneous interfaces and robust interfacial adhesion under tensile and compressive stress. Thickness of the hybrid glass and thiol-ene films range from 0.80μm to 1.5μm and 8 μm to 16 μm respectively.

scholarly journals Superconducting YBaCuO thin Films by Cu-Ion Implantation

1990 ◽  
Vol 201 ◽  
Author(s):  
Kevin M. Hubbard ◽  
Nicole Bordes ◽  
Michael Nastasi ◽  
Joseph R. Tesmer
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Thin Films ◽  
Scanning Electron Microscopy ◽  
Ion Implantation ◽  
Normal State ◽  
Ion Beam ◽  
X Ray Diffraction ◽  
X Ray ◽  
Scanning Electron

AbstractWe have investigated the fabrication of thin-film superconductors by Cu-ion implantation into initially Cu-deficient Y(BaF2)Cu thin films. The precursor films were co-evaporated on SrTiO3 substrates, and subsequently implanted to various doses with 400 keV 63Cu2+. Implantations were preformed at both LN2 temperature and at 380°C. The films were post-annealed in oxygen, and characterized as a function of dose by four-point probe analysis, X-ray diffraction, ion-beam backscattering and channeling, and scanning electron microscopy. It was found that a significant improvement in film quality could be achieved by heating the films to 380°C during the implantation. The best films became fully superconducting at 60–70 K, and exhibited good metallic R vs. T. behavior in the normal state.

Mucilaginous film production by plant cells immobilised in a polyurethane or nylon matrix

1985 ◽  
Vol 63 (12) ◽  
pp. 2357-2363 ◽  
Author(s):  
M. J. C. Rhodes ◽  
R. J. Robins ◽  
R. J. Turner ◽  
J. I. Smith
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Electron Microscope ◽  
Scanning Electron Microscope ◽  
Light Microscope ◽  
Plant Cells ◽  
The Matrix ◽  
Nylon Fibre ◽  
Scanning Electron

The surface features of plant cells immobilised in a matrix of either reticulated polyurethane foam or nylon fibre have been examined with the scanning electron microscope. It has been found that both cells and matrix are enveloped in a thin film, the appearance of which is very dependent on the method by which material is prepared for scanning electron microscopy. The structure is severely damaged by fixation and dehydration. Only in specimens examined in the frozen hydrated state is a structure seen compatible with that observed with the light microscope. From the way the appearance of the film is affected by different methods of preparation for the scanning electron microscope, it is suggested that the film is a hydrated mucilage. The importance of this film for the retention of cells within the matrix is discussed.

scholarly journals ANALISIS STRUKTUR NANO DARI LAPISAN TIPIS COBALT FERRITE YANG DIPREPARASI DENGAN METODE SPUTTERING

2017 ◽  
Vol 18 (01) ◽  
pp. 46-53 ◽  
Author(s):  
Ramli Ramli ◽  
Riri Jonuarti ◽  
Ambran Hartono
Keyword(s):  
Thin Film ◽  
Electron Microscopy ◽  
Thin Films ◽  
Scanning Electron Microscopy ◽  
Crystallite Size ◽  
Flow Rate ◽  
Cobalt Ferrite ◽  
Growth Parameter ◽  
Deposition Pressure ◽  
Scanning Electron

In this paper we report the results of studies relating to the synthesis of Cobalt Ferrite (CoFe2O4) thin films by a sputtering method. The CoFe2O4 thin film has been prepared onto silicon substrate from the sputtering targets, CoFe. Structural propertiesofthinfilms were characterized byx-ray diffraction and the morphology was characterized by scanning electron microscopy. The growth parameter are: base pressure 2,8 x 10-2 Torr, ratio of Argon:Oxygen flow rate are 100:50 sccm, deposition pressure 5.4 x10-1 Torr, growth temperature 100oC.Nanostructures of the thin film that have been analyzed are crystallite size and micro strain.We obtained the crystallite size of CoFe2O4 thin films for layer thickness of 40 and 48 nm, respectively are: 32 nm and 66 nm, while the micro strain is 8.0 x 10-4 and 10.2 x 10-4.

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