Role of Grain Boundary Cr5B3 Precipitates on Intergranular Attack in Alloy 600

2017 ◽  
pp. 359-374
Author(s):  
Daniel K. Schreiber ◽  
Matthew J. Olszta ◽  
Karen Kruska ◽  
Stephen M. Bruemmer
Keyword(s):  
Grain Boundary ◽  
Alloy 600 ◽  
Intergranular Attack

Examinations of Oxidation and Sulfidation of Grain Boundaries in Alloy 600 Exposed to Simulated Pressurized Water Reactor Primary Water

2013 ◽  
Vol 19 (3) ◽  
pp. 676-687 ◽  
Author(s):  
D.K. Schreiber ◽  
M.J. Olszta ◽  
D.W. Saxey ◽  
K. Kruska ◽  
K.L. Moore ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Grain Boundary ◽  
Grain Boundaries ◽  
Atom Probe Tomography ◽  
Atom Probe ◽  
Alloy 600 ◽  
Pressurized Water Reactor ◽  
Intergranular Attack ◽  
Pressurized Water ◽  
Primary Water

AbstractHigh-resolution characterizations of intergranular attack in alloy 600 (Ni-17Cr-9Fe) exposed to 325°C simulated pressurized water reactor primary water have been conducted using a combination of scanning electron microscopy, NanoSIMS, analytical transmission electron microscopy, and atom probe tomography. The intergranular attack exhibited a two-stage microstructure that consisted of continuous corrosion/oxidation to a depth of ~200 nm from the surface followed by discrete Cr-rich sulfides to a further depth of ~500 nm. The continuous oxidation region contained primarily nanocrystalline MO-structure oxide particles and ended at Ni-rich, Cr-depleted grain boundaries with spaced CrS precipitates. Three-dimensional characterization of the sulfidized region using site-specific atom probe tomography revealed extraordinary grain boundary composition changes, including total depletion of Cr across a several nm wide dealloyed zone as a result of grain boundary migration.

Strain-induced martensite effects on transgranular carbide precipitation in type 304 stainless steels

1991 ◽  
Vol 49 ◽  
pp. 604-605
Author(s):  
A.H. Advani ◽  
L.E. Murr ◽  
D. Matlock
Keyword(s):  
Heat Treatment ◽  
Grain Boundary ◽  
Stress Corrosion Cracking ◽  
Stainless Steels ◽  
Deformation Twin ◽  
Austenitic Stainless Steels ◽  
Carbide Precipitation ◽  
Strain Induced Martensite ◽  
Type 304

Thermomechanically induced strain is a key variable producing accelerated carbide precipitation, sensitization and stress corrosion cracking in austenitic stainless steels (SS). Recent work has indicated that higher levels of strain (above 20%) also produce transgranular (TG) carbide precipitation and corrosion simultaneous with the grain boundary phenomenon in 316 SS. Transgranular precipitates were noted to form primarily on deformation twin-fault planes and their intersections in 316 SS.Briant has indicated that TG precipitation in 316 SS is significantly different from 304 SS due to the formation of strain-induced martensite on 304 SS, though an understanding of the role of martensite on the process has not been developed. This study is concerned with evaluating the effects of strain and strain-induced martensite on TG carbide precipitation in 304 SS. The study was performed on samples of a 0.051%C-304 SS deformed to 33% followed by heat treatment at 670°C for 1 h.

On the role of tin underlays for the prevention of thermal grooving in thin gold films

1986 ◽  
Vol 44 ◽  
pp. 732-733
Author(s):  
Jin Young Kim ◽  
R. E. Hummel ◽  
R. T. DeHoff
Keyword(s):  
Thin Film ◽  
Free Surface ◽  
Grain Boundary ◽  
Beneficial Effect ◽  
Failure Mechanism ◽  
Failure Mechanisms ◽  
Distinct Advantage ◽  
Gold Films ◽  
Gold Thin Film

Gold thin film metallizations in microelectronic circuits have a distinct advantage over those consisting of aluminum because they are less susceptible to electromigration. When electromigration is no longer the principal failure mechanism, other failure mechanisms caused by d.c. stressing might become important. In gold thin-film metallizations, grain boundary grooving is the principal failure mechanism.Previous studies have shown that grain boundary grooving in gold films can be prevented by an indium underlay between the substrate and gold. The beneficial effect of the In/Au composite film is mainly due to roughening of the surface of the gold films, redistribution of indium on the gold films and formation of In2O3 on the free surface and along the grain boundaries of the gold films during air annealing.

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