Finite-Element Determination of the Equivalent Thermal Conductivity of Hollow Blocks Masonry Wall

Author(s):  
Houda Friaa ◽  
Myriam Laroussi Hellara ◽  
Abdelwaheb Dogui
Biomaterials ◽  
1996 ◽  
Vol 17 (12) ◽  
pp. 1219-1225 ◽  
Author(s):  
B. Gustin ◽  
C. G'Sell ◽  
B. Cochelin ◽  
P. Wourms ◽  
M. Potier-Ferry

2011 ◽  
Vol 2011 (1) ◽  
pp. 000025-000032 ◽  
Author(s):  
Heng-Chieh Chien ◽  
John H. Lau ◽  
Yu-Lin Chao ◽  
Ra-Min Tain ◽  
Ming-Ji Dai ◽  
...  

Thermal performance of 3D IC integration is investigated in this study. Emphasis is placed on the determination of a set of equivalent thermal conductivity equations for Cu-filled TSVs with various TSV diameters, TSV pitches, TSV thicknesses, passivation thicknesses, and microbump pads. Also, the thermal behavior of a TSV cell is examined. Furthermore, 3D heat transfer simulations are adopted to verify the accuracy of the equivalent equations. Finally, the feasibility of these equivalent equations is demonstrated through a simple 3D IC integration structure.


2015 ◽  
Vol 1092-1093 ◽  
pp. 550-554
Author(s):  
Jian Long Liu ◽  
Jie Nan Xie ◽  
Peng Liu ◽  
Mu Ye Huang

Through the three-dimensional heat transfers numerical simulation of eight kinds with the different number of holes, void ratio and arrangement of sintered shale porous brick (size: 240mm×190mm×90mm), which simulate the sintered porous brick under two different laying way that is 240mm wall and 190mm wall of equivalent thermal conductivity. The result shows: the same kind of porous brick as 240mm wall and 190mm wall, when the equivalent thermal conductivity coefficient has phased difference that the wall insulation effect is obviously different. Through the analysis of two different methods of the masonry wall thermal insulation performance of the influence by different reasons, targeted to put forward some suggestions in order to improve calorific performance of the wall.


2012 ◽  
Vol 9 (2) ◽  
pp. 97-103 ◽  
Author(s):  
Heng-Chieh Chien ◽  
John H. Lau ◽  
Yu-Lin Chao ◽  
Ra-Min Tain ◽  
Ming-Ji Dai ◽  
...  

Thermal performance of 3D IC integration is investigated in this study. Emphasis is placed on the determination of a set of equivalent thermal conductivity equations for Cu-filled TSVs with various TSV diameters, TSV pitches, TSV thicknesses, passivation thicknesses, and microbump pads. Also, the thermal behavior of a TSV cell is examined. Furthermore, 3D heat transfer simulations are adopted to verify the accuracy of the equivalent equations. Finally, the feasibility of these equivalent equations is demonstrated through a simple 3D IC integration structure.


1981 ◽  
Vol 14 (1-2) ◽  
pp. 123-128 ◽  
Author(s):  
Thomas Lee Wilkinson ◽  
R.E. Rowlands ◽  
R.D. Cook

2004 ◽  
Vol 71 (2) ◽  
pp. 179-185 ◽  
Author(s):  
J.C. Olivares ◽  
R. Escarela-Perez ◽  
S.V. Kulkarni ◽  
F. de León ◽  
M.A. Venegas-Vega

2013 ◽  
Vol 291-294 ◽  
pp. 145-151 ◽  
Author(s):  
Wan Sheng Yang ◽  
Huang Huan Guo ◽  
Zhang Yuan Wang ◽  
Xu Dong Zhao

This paper studied the thermal and physical properties of a new solar solid desiccant material, including the equivalent thermal conductivity under different moisture content conditions and penetrability under different simulated solar radiation. The results showed that the equivalent thermal conductivity of the material was related to the moisture content and water saturation. In unsaturated state, the equivalent thermal conductivity increased with the increase of the moisture content and presented a linear relation in certain range. When reached saturation, the equivalent thermal conductivity decreased with the increase of the moisture content. These figures could provide the basis for the determination of the thickness of the dehumidification bed and optimization of the design of the dehumidification system.


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