Probabilistic Physics-of-Failure Approach in Reliability Engineering

2020 ◽  
pp. 479-500
Author(s):  
Mohammad Modarres
Keyword(s):  
Reliability Engineering ◽  
Physics Of Failure

Application of Physics-of-Failure Method in Reliability Engineering of Electronic Products

2013 ◽  
Vol 313-314 ◽  
pp. 697-701
Author(s):  
Jiang Shao ◽  
Chen Hui Zeng
Keyword(s):  
Reliability Engineering ◽  
Physical Processes ◽  
Developed Country ◽  
Physics Of Failure ◽  
Electronic Products ◽  
Reliability Design ◽  
Application Condition ◽  
Reliability Method ◽  
New Period ◽  
The New Period

Physics-of-Failure (PoF) represents one approach to reliability assessment based on modeling and simulation that relies on understanding the physical processes contributing to the appearance of the critical failures. Firstly the connotation and meaning of PoF method were analyzed here, the inherence relation between PoF and reliability was expatiated, the PoF based reliability method and current reliability method based on probability statistics were compared, their differences and relationships were discussed here. Then the application condition of PoF method in reliability engineering in European and American developed country and China were summarized, the PoF based reliability engineering technologies were introduced systemically from several aspects, such as reliability design and analysis, reliability test and validation, maintain and support. Finally, combining with the developing characteristics of military materiel during the new period, some future investigation directions and application foregrounds were prospected.

New Methods of Reliability Engineering

2013 ◽  
Vol 397-400 ◽  
pp. 842-845
Author(s):  
Yu Lian Cui ◽  
Cheng Ming He ◽  
Jun Wei Wang
Keyword(s):  
Rapid Development ◽  
Industrial Technology ◽  
Reliability Engineering ◽  
Product Reliability ◽  
Physics Of Failure ◽  
New Methods ◽  
Reliability Methods ◽  
Quality Process

The rapid development of industrial technology puts forward higher and higher demands on the product reliability and the traditional reliability methods have been challenged. In this paper, two methods applied in reliability engineering in recent years are discussed. The methods include the axiomatic quality process and physics of failure method.

F-22 Subsystem Fleet Management Trend Analysis

2009 ◽  
Author(s):  
Stefan M. Glista ◽  
David J. Rushing ◽  
Charles R. Lide ◽  
Patrick C. McPherson
Keyword(s):  
Learning Curve ◽  
Growth Curves ◽  
Reliability Growth ◽  
Reliability Engineering ◽  
Physics Of Failure ◽  
Durability Analysis ◽  
Distribution Shape ◽  
Proposed Model ◽  
Qualification Testing ◽  
Insight Into

Reliability growth curves are modeled using the results of Weibull distribution regression analysis. The Weibull Learning Curve (WLC) model is useful because it provides an early statistical indication of wear out issues. The vibration, thermal, humidity and corrosion environments of the F-22 are severe. It is prudent to be concerned about wearout problems in severe aircraft environments. The power of Weibull is the ability to predict the characteristic life and distribution shape with a small amount of data. The proposed model is compared to the traditional Duane Learning Curve approach. Statistical model validity is evaluated using numeric and graphical methods, including coefficients of determination (r2) and residuals. The WLC model provides insight into interdisciplinary issues, including supplier quality control, qualification testing, physics of failure, and reliability engineering. In addition, the WLC model quantifies the number of items with removal statistics consistent with wearout; therefore, this study helps to quantify successes and shortfalls of durability analysis and testing approaches.

Reliability Engineering. Study on "Fibro-Composites". Morphology of PBT/PE Blend.

1998 ◽  
Vol 47 (12) ◽  
pp. 1270-1275 ◽  
Author(s):  
Kazuo KITAGAWA ◽  
Takeshi SEMBA ◽  
Hiroyuki HAMADA
Keyword(s):  
Reliability Engineering ◽  
Engineering Study

Signature Analysis: Statistical Models and Their Application to FA

1996 ◽  
Author(s):  
C.K. Lakshminarayan ◽  
S. Pabbisetty ◽  
O. Adams ◽  
F. Pires ◽  
M. Thomas ◽  
...  
Keyword(s):  
Risk Assessment ◽  
Failure Analysis ◽  
Statistical Models ◽  
Essential Elements ◽  
Assessment Model ◽  
Signature Analysis ◽  
Risk Assessment Model ◽  
Sample Sizes ◽  
Reliability Engineering ◽  
Semiconductor Chips

Abstract This paper deals with the basic concepts of Signature Analysis and the application of statistical models for its implementation. It develops a scheme for computing sample sizes when the failures are random. It also introduces statistical models that comprehend correlations among failures that fail due to the same failure mechanism. The idea of correlation is important because semiconductor chips are processed in batches. Also any risk assessment model should comprehend correlations over time. The statistical models developed will provide the required sample sizes for the Failure Analysis lab to state "We are A% confident that B% of future parts will fail due to the same signature." The paper provides tables and graphs for the evaluation of such a risk assessment. The implementation of Signature Analysis will achieve the dual objective of improved customer satisfaction and reduced cycle time. This paper will also highlight it's applicability as well as the essential elements that need to be in place for it to be effective. Different examples have been illustrated of how the concept is being used by Failure Analysis Operations (FA) and Customer Quality and Reliability Engineering groups.

Enhancement of Physics-of-Failure Prognostic Models with System Level Features

2002 ◽  
Author(s):  
Gregory J. Kacprzynski ◽  
Michael J. Roemer ◽  
Girish Modgil ◽  
Andrea Palladino ◽  
Kenneth Maynard
Keyword(s):  
System Level ◽  
Prognostic Models ◽  
Physics Of Failure
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