Smart Public Safety: Application of Mobile Electronic System Integration (MOBESE) in Istanbul

Since, the industrial electronics is trending towards more compact components and system integration, innovative products offering greater flexibility, quality, safety, reliability, energy savings, wide range of connectivity with long operating lifetime. Now, Electronics is widely used in information processing, telecommunication and signal processing. Due to the complex nature of electronics theory, laboratory experimentation is an important part of development of electronic devices. These experiments are used to test or verify the proposed design and detect errors. Historically, electronics labs have consisted of electronic devices and equipment located in the physical space. Although in more recent years, the trend has been towards electronics lab simulation softwares and SystemVue is also one of them. SystemVue is a focussed electronic design automation (EDA) environment for electronic system-level (ESL) design. It enables system architects and algorithm developers to innovate the physical layer (PHY) of wireless and aerospace/defence communication systems and provide unique value to RF, DSP and FPGA/ASIC implementers. As a dedicated platform for ESL design and signal processing realization, SystemVue replaces general-purpose digital, analog and math environments. SystemVue “speaks RF”, cuts PHY development and verification time in half and connects to your mainstream EDA flow.

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2016 6th Electronic System-Integration Technology Conference (ESTC)

10.1109/estc38041.2016 ◽

2016 ◽

Keyword(s):

System Integration ◽

Electronic System ◽

Integration Technology

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2012 4th Electronic System-Integration Technology Conference

10.1109/estc20972.2012 ◽

2012 ◽

Keyword(s):

System Integration ◽

Electronic System ◽

Integration Technology

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Packaging Tradeoff for SIP Integration Targeting High Speed PAM-4 Applications

International Symposium on Microelectronics ◽

10.4071/isom-poster3 ◽

2015 ◽

Vol 2015 (1) ◽

pp. 000730-000734

Author(s):

B Haentjens ◽

G Desruelles ◽

G Chrétien ◽

A Leborgne ◽

Y Haentjens ◽

...

Keyword(s):

System Integration ◽

High Speed ◽

Pulse Amplitude ◽

Electronic System ◽

Design Flow ◽

Ultra Wideband ◽

Optical Modulators ◽

Eye Diagram ◽

Modulation Format ◽

Bga Package

High speed transmission systems using optical fiber are now focusing on 4-level PAM (Pulse Amplitude Modulation) format. This is requesting ultra-wideband electronic system in package, with a high phase linearity behavior in order to drive the electro-optical modulators. Moreover, new power DAC (Digital to Analog Converter) dies, are now available to generate up to 56 GBd, 4-level PAM signals, and providing 4Vpp of differential output amplitude swing. High frequency studies have been pursued to provide system integration in a BGA (Ball Grid Array) package. The BGA package transitions optimization and the configuration of multi-lines carriers, becomes a key step in the design flow. In this paper, some steps of the design, manufacturing process of the SIP (System In Package) and its demonstration board are proposed. The choices of the package, the thermal management, the clock management function are studied according to the final environmental constraint of the SIP. The data lines phase skew are analyzed with the support of EM (Electro Magnetic) simulations to better understand the potential impact on the output eye. Finally, the BGA package transition, simulated and measured results are compared, from DC up to 40 GHz and the measured SIP output, 4 levels, 56GBps eye diagram is presented.

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