Contactless Testing | ScienceGate

Abstract Friction brake temperature due to its influence on brakes’ operation is subject to many test and studies. Measurements methods of this important brake parameter are being continuously developed. In order to withstand difficulty in temperature evaluation in full brake system as well as in isolated friction pair is use of contactless measurement methods. Currently, the most widespread contactless testing method of the thermal effects is to measure infrared emission by pyrometers or thermographic (infrared) cameras. Thermal imaging method wasn’t used so far during aviation brake materials usefulness evaluation and certification testing performed in Instytut Lotnictwa Landing Gear Laboratory. In this paper, author described performed friction materials tests which were recorded with thermal imaging camera as well as evaluated usefulness of the method by comparing its accuracy to thermocouple measurement.

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Wafer-Level Contactless Testing Based on UHF RFID Tags With Post-Process On-Chip Antennas

IEEE Transactions on Circuits & Systems II Express Briefs ◽

10.1109/tcsii.2018.2852949 ◽

2018 ◽

Vol 65 (10) ◽

pp. 1355-1359 ◽

Cited By ~ 2

Author(s):

Alessandro Finocchiaro ◽

Giovanni Girlando ◽

Alessandro Motta ◽

Alberto Pagani ◽

Egidio Ragonese ◽

...

Keyword(s):

Rfid Tags ◽

Uhf Rfid ◽

Wafer Level ◽

Post Process ◽

Contactless Testing ◽

On Chip

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Contactless Testing and Diagnosis Techniques

Advanced Circuits for Emerging Technologies ◽

10.1002/9781118181508.ch23 ◽

2012 ◽

pp. 581-597

Author(s):

Selahattin Sayil

Keyword(s):

Contactless Testing

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Circuits Design for Contactless Testing of Nano-Scale CMOS Devices and Circuits

Nanoscience and Nanotechnology Letters ◽

10.1166/nnl.2012.1421 ◽

2012 ◽

Vol 4 (9) ◽

pp. 930-935 ◽

Cited By ~ 1

Author(s):

Xiao Peng Yu ◽

Zheng Hao Lu ◽

Wei Meng Lim ◽

Yang Liu ◽

Chang Hui Hu

Keyword(s):

Nano Scale ◽

Contactless Testing

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Contactless Testing for Prebond Interposers

IEEE Transactions on Very Large Scale Integration (VLSI) Systems ◽

10.1109/tvlsi.2018.2805850 ◽

2018 ◽

Vol 26 (6) ◽

pp. 1005-1014

Author(s):

Kai-Hsiang Hsu ◽

Yung-Chih Chen ◽

You-Luen Lee ◽

Shih-Chieh Chang

Keyword(s):

Contactless Testing

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Contactless Testing of Pulse Propagation in IC’s - A Comparison Between OBIC and Captive-Coupling Detection Techniques

ISTFA 1996: Conference Proceedings from the 22nd International Symposium for Testing and Failure Analysis ◽

10.31399/asm.cp.istfa1996p0251 ◽

1996 ◽

Author(s):

K. Hempel ◽

G. Sargsjan ◽

H. Bergner

Keyword(s):

Laser Scanning ◽

Pulse Propagation ◽

External Input ◽

Capacitive Coupling ◽

Scanning Microscope ◽

Time Resolved ◽

Detection Techniques ◽

Contactless Testing ◽

Stimulation Of ◽

Time Resolved Measurements

Abstract Internal IC probing has become an important tool for failure analysis and defect localization. Optical stimulation of logical transients enables the investigation of electrical pulse propagation through IC-regions which are not directly connected to an external input. The signal detection should be as directly as possible to avoid misinterpretation of experimental results, especially for time-resolved measurements. This paper describes the implementation of a capacitive coupling technique on a laser scanning microscope and on a needle prober. Results of static and time-resolved measurements are presented and compared to those obtained by OBIC measurements.

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