Thermal and Mechanical Characterization of Electronic Packages in Extremely High Frequency Applications by Means of Finite Element Analysis

1997 ◽  
pp. 349-359 ◽  
Author(s):  
J.-P. Sommer ◽  
R. Dudek ◽  
B. Michel ◽  
M. Boheim ◽  
W. Hager
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
High Frequency ◽  
Mechanical Characterization ◽  
Electronic Packages ◽  
Element Analysis ◽  
Extremely High Frequency

scholarly journals Mechanical Characterization of Compact Rolled‐up Microtubes Using In Situ Scanning Electron Microscopy Nanoindentation and Finite Element Analysis

2021 ◽  
Vol 23 (8) ◽  
pp. 2170031
Author(s):  
Somayeh Moradi ◽  
Nathanael Jöhrmann ◽  
Dmitriy D. Karnaushenko ◽  
Uwe Zschenderlein ◽  
Daniil Karnaushenko ◽  
...  
Keyword(s):  
Electron Microscopy ◽  
Scanning Electron Microscopy ◽  
Finite Element Analysis ◽  
Finite Element ◽  
Mechanical Characterization ◽  
Element Analysis ◽  
Scanning Electron
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