Computer File Signature Analysis Through Hexadecimal Editor Software

Author(s):  
Shshank Sourabh ◽  
Monika Chauhan
1978 ◽  
Vol 17 (02) ◽  
pp. 103-105
Author(s):  
D. Lahaye ◽  
D. Roosels ◽  
J. Viaene

Based on the analysis of 13,110 medical examinations performed on a standardized population of pneumoconiosis patients recorded on the F.O.D. computer file, the authors describe the value of the subjective estimations of »obesity«, »thinness« or »normal weight« by their correlation with the observed weight and height. Although there are striking differences in appreciation between the physicians performing the examinations, the qualifications »obese«, »thin« or »normal« correspond with real group differences in weight, between certain limits which can be defined. The ratio between the observed weight and the expected weight (using the Broca formula) shows the same pattern. In tins way it becomes possible to propose upper and lower limits for obesity, thinness and normal weight based on purely empiric data. Feeding back this information to the examining physicians should help reduce the differences between physicians and improve the results. Therefore, the authors find it useful to keep such information in the computer file.


Author(s):  
C.K. Lakshminarayan ◽  
S. Pabbisetty ◽  
O. Adams ◽  
F. Pires ◽  
M. Thomas ◽  
...  

Abstract This paper deals with the basic concepts of Signature Analysis and the application of statistical models for its implementation. It develops a scheme for computing sample sizes when the failures are random. It also introduces statistical models that comprehend correlations among failures that fail due to the same failure mechanism. The idea of correlation is important because semiconductor chips are processed in batches. Also any risk assessment model should comprehend correlations over time. The statistical models developed will provide the required sample sizes for the Failure Analysis lab to state "We are A% confident that B% of future parts will fail due to the same signature." The paper provides tables and graphs for the evaluation of such a risk assessment. The implementation of Signature Analysis will achieve the dual objective of improved customer satisfaction and reduced cycle time. This paper will also highlight it's applicability as well as the essential elements that need to be in place for it to be effective. Different examples have been illustrated of how the concept is being used by Failure Analysis Operations (FA) and Customer Quality and Reliability Engineering groups.


Author(s):  
S.X. Li ◽  
K. Lee ◽  
J. Hulog ◽  
R. Gannamani ◽  
S. Yin

Abstract Package delaminations are often associated with electrical and package reliability problems in IC devices. Delaminations caused by electrical-over-stress (EOS) and moisture expansion during reflow soldering have shown different delamination patterns. A Scanning Acoustic Microscope (SAM) can be used to detect package delaminations. Understanding these delamination signatures can help us quickly identify the failure cause at an early stage of the failure analysis.


Sign in / Sign up

Export Citation Format

Share Document