Numerical Analysis of Smooth and Wavy Wall Microchannel Heat Sink for Electronic Cooling Applications

Author(s):  
D. Sathish Kumar ◽  
S. Jayavel
Author(s):  
Gabriel Gamrat ◽  
Michel Favre-Marinet ◽  
Dariusz Asendrych

The paper presents both three and two-dimensional numerical analysis of convective heat transfer in microchannels. The three-dimensional geometry of the microchannel heat sink followed the details of the experimental facility used during a previous research step. The heat sink consisted of a very high aspect ratio rectangular microchannel. Two channel heights, namely 1mm and 0.3mm (0.1mm), were used for 3D (2D) numerical model respectively. Water was employed as the cooling liquid. The Reynolds number ranged from 200 to 3000. In the paper, the thermal entrance effect is analyzed in terms of heat transfer efficiency. Finally, the comparison between measured and computed heat flux and temperature fields is presented. Contrary to the experimental work, the numerical analysis did not reveal any significant scale effect in heat transfer in microchannel heat sink up to the smallest size considered (0.1 mm).


2018 ◽  
Vol 14 (1) ◽  
Author(s):  
Subhash V. Jadhav ◽  
Prashant M. Pawar ◽  
Babruvahan P. Ronge

Abstract Purpose A numerical analysis is carried out to study the effect of pin fin geometry on the performance of microchannel heat sinks. Design/methodology/approach A three-dimensional numerical analysis is carried out using the conjugate heat transfer module of COMSOL MULTIPHYSICS software. Initially, the study is carried out for a microchannel heat sink with elliptical pin fins of 500 µm fin height, and the results of the same are validated with the results obtained from the literature. Further, the effect of different pin fin shapes and pin fin heights is investigated in terms of Nusselt number and pressure drop. The analysis is carried out with different pin fin shapes viz. ellipse, circle, square and hexagon. The pin fin height for all channels is varied from 300 µm to 700 µm. The total surface area of the channel coming into contact with coolant is kept constant for different coolant inflow velocities. Findings Higher values of Nusselt numbers are obtained for fin pins at larger height and high coolant inlet velocities. At coolant inlet velocity of 1 m/s, as pin fin height increases from 300 µm to 700 µm, the channel with circular pin fins shows a maximum increment of 66 % and elliptical pin fins shows a minimum increment of 40 % in terms of Nusselt number. A maximum value of Nusselt number observed is 21.36 with square pin fins of 700 µm fin height and a minimum of 6.03 Nusselt number with circular fins of 300 µm fin height. OriginalityOriginality/Value This study is useful in appropriate selection of pin fin geometry for enhancing the performance of microchannel heat sink.


2013 ◽  
Vol 394 ◽  
pp. 173-178 ◽  
Author(s):  
Liang Gong ◽  
Bo Wei

The flow and heat transfer characteristics were numerically studied in wave, dimple and wave-dimple microchannels for thermal managements on the chip of Intel i7-996X with heat flux of 0.56 W/mm2.The results show that, in microchannles heat sink, the dimple structure could reduce the flow resistances and the wavy wall could enhance heat transfer. According to the both advantages, two types of microchannel heat sink both with dimples and wavy walls were designed, and the flow and heat transfer characteristics were numerically studied. It is proved that the wave-dimple microchannels heat sink holds the characteristics of enhancing heat transfer with low pressure drop, which implies it has great potential of development and application prospect.


2019 ◽  
Vol 50 (8) ◽  
pp. 757-772 ◽  
Author(s):  
Yicang Huang ◽  
Hui Li ◽  
Shengnan Shen ◽  
Yongbo Xue ◽  
Mingliang Xu ◽  
...  

Sign in / Sign up

Export Citation Format

Share Document