Thickness dependence of electrical properties in thin films of undoped indium oxide prepared by ion-beam sputtering

1989 ◽  
Vol 24 (1) ◽  
pp. 187-191 ◽  
Author(s):  
T. Suzuki ◽  
T. Yamazaki ◽  
M. Takizawa ◽  
O. Kawasaki
2007 ◽  
Vol 4 (2) ◽  
pp. 260-262
Author(s):  
Baghdad Science Journal

The electrical properties of the AlNiCo thin films with thickness (1000oA) deposited on glass substrates using Ion – Beam sputtering (IBS) technique under vacuum


2021 ◽  
Author(s):  
A. Atta ◽  
E. Abdeltwab ◽  
Alpan Bek

Abstract Copper (Cu) thin films are deposited on polyethyleneterephthalate (PET) substrate using ion-beam-sputtering technique. The formation of Cu thin films is successful confirmed as investigated by X-ray diffraction (XRD). Surface morphology of Cu/PET is studied by atomic force microscopy (AFM). The AFM results show that Cu film dewets PET surface and the surface roughness increased from 22.6 nm for PET to 45.3 nm after 40min of deposited Cu/PET. The sheet resistance decreases from 5.16x104Ω to 1.3x104Ω and resistivity decreases from 2.3x10-2Ω.cm to 1.77x10-2Ω.cm, as the Cu deposition time increases from 20min to 60min. The Young’s modulus increases from 2.82GPa to 2.96GPa and the adhesion force enhanced from 14.7nN to 29.90nN after 40min of Cu deposition. The DC electrical conductivity at 300V is improved from 1.75x10-8 S.cm-1 to 3.57x10-8 S.cm-1 after 60min of Cu deposition. The results show that ion beam deposition of Cu on flexible PET platform clearly exhibits improvement over pristine PET in the mechanical and electrical properties which renders it useful for electronics applications.


2008 ◽  
Vol 100 (1) ◽  
pp. 228-237 ◽  
Author(s):  
F. JOMNI ◽  
H. OUAJJI ◽  
A. SYLVESTRE ◽  
J. GUILLAN ◽  
E. DEFAŸ ◽  
...  

1996 ◽  
Vol 8 (1/2) ◽  
pp. 27-28
Author(s):  
Mitsuhiro WADA ◽  
Yoshihito MATSUMURA ◽  
Hirohisa UCHIDA ◽  
Haru-Hisa UCHIDA ◽  
Hideo KANEKO

1988 ◽  
Vol 23 (8) ◽  
pp. 3026-3030 ◽  
Author(s):  
Takeyuki Suzuki ◽  
Tsutomu Yamazaki ◽  
Harunobu Oda

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