Mechanical properties of condensed copper films in the microdeformation region

1970 ◽  
Vol 13 (6) ◽  
pp. 780-782
Author(s):  
K. K. Ziling ◽  
L. D. Pokrovskii ◽  
V. Yu. Pchelkin
Keyword(s):  
Mechanical Properties ◽  
Copper Films ◽  
Condensed Copper

Measurement and interpretation of stress in copper films as a function of thermal history

1991 ◽  
Vol 6 (7) ◽  
pp. 1498-1501 ◽  
Author(s):  
Paul A. Flinn
Keyword(s):  
Mechanical Properties ◽  
Thermal Expansion ◽  
Elastic Modulus ◽  
Thermal History ◽  
Copper Films ◽  
Thermally Induced ◽  
Aluminum Films ◽  
Interconnection Material ◽  
Interconnect Systems

Since copper has some advantages relative to aluminum as an interconnection material, it is appropriate to investigate its mechanical properties in order to be prepared in advance for possible problems, such as the cracks and voids that have plagued aluminum interconnect systems. A model previously used to interpret the behavior of aluminum films proves to be, with minor modification, also applicable to copper. Although the thermal expansion of copper is closer to that of silicon and, consequently, the thermally induced strains are smaller, the much larger elastic modulus of copper results in substantially higher stresses. This has implications for the interaction of copper lines with dielectrics.

Influence of a Capping Layer on the Mechanical Properties of Copper Films

1994 ◽  
Vol 356 ◽  
Author(s):  
R.-M. Keller ◽  
S. Bader ◽  
R. P. Vinci ◽  
E. Arzt
Keyword(s):  
Mechanical Properties ◽  
Film Thickness ◽  
Grain Growth ◽  
Low Temperatures ◽  
Bauschinger Effect ◽  
Diffusional Creep ◽  
Copper Films ◽  
Cu Films ◽  
Heating And Cooling ◽  
Cooling Stress

AbstractThe substrate curvature technique was employed to study the mechanical properties of 0.6 μm and 1.0 μm Cu films capped with a 50 nm thick Si3N4 layer and to compare them with the mechanical properties of uncapped Cu films. The microstructures of these films were also investigated. Grain growth, diffusional creep and dislocation processes are impeded by the cap layer. This is evident in the form of high stresses at high temperatures on heating and at low temperatures on cooling. At intermediate temperatures on heating and cooling, stress plateaus a relatively low stresses exist. This can be explained by the so-called Bauschinger effect. A film thickness dependence of the stresses in the film could not be observed for capped Cu films.

scholarly journals Mechanical properties and reliability of copper films deposited from electroless plating baths containing glycine and potassium hexacyanoferrate(II)

1986 ◽  
Vol 37 (3) ◽  
pp. 121-125
Author(s):  
Shozo MIZUMOTO ◽  
Hidemi NAWAFUNE ◽  
Motoo KAWASAKI ◽  
Akemi KINOSHITA ◽  
Ken ARAKI
Keyword(s):  
Mechanical Properties ◽  
Electroless Plating ◽  
Copper Films ◽  
Potassium Hexacyanoferrate

Mechanical Properties of Copper Films

1970 ◽  
Vol 41 (1) ◽  
pp. 402-406 ◽  
Author(s):  
H. Leidheiser ◽  
Billy W. Sloope
Keyword(s):  
Mechanical Properties ◽  
Copper Films

scholarly journals Mechanical Properties of Micro- and Nanostructured Copper Films

2013 ◽  
Vol 01 (05) ◽  
pp. 7-10
Author(s):  
N. Kosarev ◽  
M. Khazin ◽  
R. Apakashev ◽  
N. Valiev
Keyword(s):  
Mechanical Properties ◽  
Copper Films ◽  
Nanostructured Copper

Experimental-Numerical Approach for Characterization of Mechanical Properties of Thin Electrochemically Deposited Chromium and Copper Films

2010 ◽  
Vol 159 ◽  
pp. 157-162
Author(s):  
Sabina Cherneva ◽  
Milko Yordanov ◽  
Dimitar Stoychev ◽  
Rumen Iankov
Keyword(s):  
Mechanical Properties ◽  
Finite Element Method ◽  
Finite Element ◽  
Numerical Simulations ◽  
Numerical Approach ◽  
Copper Films ◽  
The Finite Element Method ◽  
Electrochemically Deposited ◽  
Nanoindentation Experiment ◽  
Load Displacement

A hybrid experimental-numerical approach, which combines microindentation experiments (where we measure the diagonal of the residual imprint after unloading) and numerical simulations by means of the finite-element method has been developed. The investigated materials in the present work are electrochemically deposited on brass substrates chromium and copper films with known thickness and unknown mechanical properties. Mechanical properties of the brass (CuZn36) substrate are known. Vickers’ microindentation experiments were carried out on the films and as a result the experimental load-displacement curves were obtained. After that the process of microindentation was modelled numerically by means of the finite-element method. Numerically obtained load-displacement curves were compared with the experimental curves. The results show good coincidence between numerical and experimental curves. Additionally it was realized nanoindentation experiment of thin copper film and these two methods (nanoindentation experiment and hybrid experimental-numerical method which combines experiment of microindentation and numerical simulations) for determination of mechanival properties of thin copper films were compared. Results obtained by means of the afore-mentioned two methods almost coincide but the second method is cheaper and gives more information about material properties of the film than the first method. It is shown that the second method is preferable to determine the mechanical properties of thin metal films.

Effects of microstructure on the mechanical properties of copper films for high aspect ratio structures

2004 ◽  
Vol 10 (6-7) ◽  
pp. 451-455 ◽  
Author(s):  
M. J. Cordill ◽  
T. Muppidi ◽  
N. R. Moody ◽  
D. F. Bahr
Keyword(s):  
Mechanical Properties ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Copper Films

Mechanical properties of vacuum-deposited metal films—I. Copper films

1975 ◽  
Vol 23 (2) ◽  
pp. 177-185 ◽  
Author(s):  
C.A.O Henning ◽  
F.W Boswell ◽  
J.M Corbett
Keyword(s):  
Mechanical Properties ◽  
Metal Films ◽  
Copper Films ◽  
Deposited Metal
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