Parametric study of injection molding and hot embossing in polymer microfabrication

2007 ◽  
Vol 21 (10) ◽  
pp. 1477-1482 ◽  
Author(s):  
Cheng -Hsien Wu ◽  
Hsien -Chang Kuo
Keyword(s):  
Injection Molding ◽  
Parametric Study ◽  
Hot Embossing ◽  
Polymer Microfabrication

Simulation and Fabrication of Novel Polymeric Tunneling Sensor by Hot Embossing Technique

2002 ◽  
Author(s):  
Tianhong Cui ◽  
Kody Varahramyan ◽  
Yongjun Zhao ◽  
Jing Wang
Keyword(s):  
Aspect Ratio ◽  
Silicon Wafer ◽  
Optimum Design ◽  
High Aspect Ratio ◽  
Hot Embossing ◽  
Anodic Bonding ◽  
Glass Disk ◽  
Icp Etching ◽  
Sensor Platform ◽  
Polymer Microfabrication

This paper reports the simulation and fabrication of novel polymer-based tunneling sensors by hot embossing technique, one of the advanced polymer microfabrication technologies. ANSYS is the software tools used to simulate the mechanical microstructures of the polymer tunneling sensors. Following the optimum design of the sensors, the mold inserts of hot embossing are fabricated by anodic bonding of glass disk 5 mm think and silicon wafer, with high-aspect-ratio microstructures by ICP etching. Main structures of polymer-based tunneling sensors are hot embossed on PMMA, followed by plastic bonding to form lateral tunneling sensor platform.

Parametric Study of Hot Embossing on Micro-Holes

2009 ◽  
Vol 74 ◽  
pp. 251-254
Author(s):  
Cheng Hsien Wu ◽  
Chen Hao Hung ◽  
Ya Zhen Hu
Keyword(s):  
Process Parameters ◽  
Parametric Study ◽  
Hot Embossing ◽  
Micro Holes ◽  
Very High

This report describes the application of hot embossing to produce parts with microstructure. An embossing machine, designed for microfabrication, was used to emboss PMMA and PC substrates. An insert with micro-holes of various diameters was applied in the hot embossing experiments. Effects of process parameters, such as embossing temperature, embossing force, embossing period and demolding temperature, on replicated heights were studied. Results show that replicated heights on smaller holes are smaller. Embossing temperature is the most important factor. Demolding temperature hardly affects the replication ability. Replicated heights increase with embossing period. The height can reach a very high value with a large enough embossing period.

Microfabrication by hot embossing and injection molding at LASTI

2004 ◽  
Vol 10 (10) ◽  
pp. 682-688 ◽  
Author(s):  
H. Mekaru ◽  
T. Yamada ◽  
S. Yan ◽  
T. Hattori
Keyword(s):  
Injection Molding ◽  
Hot Embossing

Nanoreplication in polymers using hot embossing and injection molding

2000 ◽  
Vol 53 (1-4) ◽  
pp. 171-174 ◽  
Author(s):  
H. Schift ◽  
C. David ◽  
M. Gabriel ◽  
J. Gobrecht ◽  
L.J. Heyderman ◽  
...  
Keyword(s):  
Injection Molding ◽  
Hot Embossing

Hot embossing and injection molding for micro-optical components

1997 ◽  
Author(s):  
Mathias Heckele ◽  
Walter Bacher ◽  
Thomas Hanemann ◽  
Heinrich Ulrich
Keyword(s):  
Injection Molding ◽  
Hot Embossing ◽  
Optical Components
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