Simulation and Fabrication of Novel Polymeric Tunneling Sensor by Hot Embossing Technique

2002 ◽  
Author(s):  
Tianhong Cui ◽  
Kody Varahramyan ◽  
Yongjun Zhao ◽  
Jing Wang
Keyword(s):  
Aspect Ratio ◽  
Silicon Wafer ◽  
Optimum Design ◽  
High Aspect Ratio ◽  
Hot Embossing ◽  
Anodic Bonding ◽  
Glass Disk ◽  
Icp Etching ◽  
Sensor Platform ◽  
Polymer Microfabrication

This paper reports the simulation and fabrication of novel polymer-based tunneling sensors by hot embossing technique, one of the advanced polymer microfabrication technologies. ANSYS is the software tools used to simulate the mechanical microstructures of the polymer tunneling sensors. Following the optimum design of the sensors, the mold inserts of hot embossing are fabricated by anodic bonding of glass disk 5 mm think and silicon wafer, with high-aspect-ratio microstructures by ICP etching. Main structures of polymer-based tunneling sensors are hot embossed on PMMA, followed by plastic bonding to form lateral tunneling sensor platform.

Manufacture of High Aspect Ratio Bulk Titanium Micro-Parts by Inductively Coupled Plasma Etching

2008 ◽  
Author(s):  
Gang Zhao ◽  
Qiong Shu ◽  
Yue Li ◽  
Jing Chen
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Inductively Coupled Plasma ◽  
Etching Rate ◽  
Sidewall Roughness ◽  
Inductively Coupled ◽  
Icp Etching ◽  
Novel Technology ◽  
Micro Parts ◽  
Etching Mask

A novel technology is developed to fabricate high aspect ratio bulk titanium micro-parts by inductively coupled plasma (ICP) etching. An optimized etching rate of 0.9 μm/min has been achieved with an aspect ratio higher than 10:1. For the first time, SU-8 is used as titanium etching mask instead of the traditional hard mask such as TiO2 or SiO2. With an effective selectivity of 3 and a spun-on thickness beyond 100 μm, vertical etching sidewall and low sidewall roughness are obtained. Ultra-deep titanium etching up to 200 μm has been realized, which is among the best of the present reports. Titanium micro-springs and planks are successfully fabricated with this approach.

Roll-to-Roll Hot Embossing of High Aspect Ratio Micro Pillars for Superhydrophobic Applications

2019 ◽  
Vol 34 (5) ◽  
pp. 502-512 ◽  
Author(s):  
N. Kodihalli Shivaprakash ◽  
J. Zhang ◽  
T. Nahum ◽  
C. Barry ◽  
Q. Truong ◽  
...  
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Hot Embossing ◽  
Roll To Roll ◽  
Micro Pillars

SU-8 Processing on a Variety of Substrates

1999 ◽  
Vol 605 ◽  
Author(s):  
Yuh-Min Chiang ◽  
Mark Bachman ◽  
Hung-Pin Chang ◽  
Charles Chu ◽  
G. P. Li
Keyword(s):  
Surface Tension ◽  
Aspect Ratio ◽  
Surface Properties ◽  
Silicon Wafer ◽  
Environmental Conditions ◽  
High Aspect Ratio ◽  
Silicon Substrates

AbstractSU-8 has become a popular material for micromachining high aspect ratio structures. Typically, SU-8 is spun on a polished silicon wafer for processing. After patterning, the SU-8 is used for micromachined structures directly (such as fluidic channels) or as a mold for electroforming. Non-silicon substrates offer the possibility of cheaper processing, improved mold designs, and multi-material devices. Successful SU-8 processing depends strongly on surface properties of the substrate itself as well as environmental conditions during the processing. We explore the issues involved in transferring SU-8 technology to non-silicon substrates such as glass, plastics and metals. Issues such as wettability, adhesion, and surface tension are explored in this study. The findings indicate the merits of non-spinning approaches, such as dipping, spraying, and brushing and point to new SU-8 processes.

Hot embossing of photonic crystal polymer structures with a high aspect ratio

2011 ◽  
Vol 21 (2) ◽  
pp. 025017 ◽  
Author(s):  
Mauno Schelb ◽  
Christoph Vannahme ◽  
Alexander Kolew ◽  
Timo Mappes
Keyword(s):  
Photonic Crystal ◽  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Hot Embossing ◽  
Crystal Polymer

Extremely high aspect ratio GaAs and GaAs/AlGaAs nanowaveguides fabricated using chlorine ICP etching with N2-promoted passivation

2010 ◽  
Vol 21 (13) ◽  
pp. 134014 ◽  
Author(s):  
Maïté Volatier ◽  
David Duchesne ◽  
Roberto Morandotti ◽  
Richard Arès ◽  
Vincent Aimez
Keyword(s):  
Aspect Ratio ◽  
High Aspect Ratio ◽  
Icp Etching
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