Effects of surface/interface elasticity on the screw dislocation-induced stress field in an elastic film–substrate system

Author(s):  
Ming Dai ◽  
Peter Schiavone
2019 ◽  
Vol 10 (1) ◽  
pp. 171-181
Author(s):  
Bing Guan ◽  
Shibin Li ◽  
Jiran Liu ◽  
Ligang Zhang ◽  
Shuangqing Chen

2013 ◽  
Vol 81 (5) ◽  
Author(s):  
Qiming Wang ◽  
Xuanhe Zhao

Subject to a compressive membrane stress, an elastic film bonded on a substrate can become unstable, forming wrinkles, creases or delaminated buckles. Further increasing the compressive stress can induce advanced modes of instabilities including period-doubles, folds, localized ridges, delamination, and coexistent instabilities. While various instabilities in film-substrate systems under compression have been analyzed separately, a systematic and quantitative understanding of these instabilities is still elusive. Here we present a joint experimental and theoretical study to systematically explore the instabilities in elastic film-substrate systems under uniaxial compression. We use the Maxwell stability criterion to analyze the occurrence and evolution of instabilities analogous to phase transitions in thermodynamic systems. We show that the moduli of the film and the substrate, the film-substrate adhesion strength, the film thickness, and the prestretch in the substrate determine various modes of instabilities. Defects in the film-substrate system can facilitate it to overcome energy barriers during occurrence and evolution of instabilities. We provide a set of phase diagrams to predict both initial and advanced modes of instabilities in compressed film-substrate systems. The phase diagrams can be used to guide the design of film-substrate systems to achieve desired modes of instabilities.


2020 ◽  
Vol 191-192 ◽  
pp. 473-485
Author(s):  
H.B. Yin ◽  
L.H. Liang ◽  
Y.G. Wei ◽  
Z.L. Peng ◽  
S.H. Chen

2008 ◽  
Vol 1139 ◽  
Author(s):  
Jae Hun Kim ◽  
Andrew Gouldstone ◽  
Chad S. Korach

AbstractAccurate mechanical property measurement of films on substrates by instrumented indentation requires a solution describing the effective modulus of the film/substrate system. Here, a first-order elastic perturbation solution for spherical punch indentation on a film/substrate system is presented. Finite element method (FEM) simulations were conducted for comparison with the analytic solution. FEM results indicate that the new solution is valid for a practical range of modulus mismatch, especially for a stiff film on a compliant substrate.


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