Through-mask electrochemical machining of a large-area hole array in a serpentine flow channel

2016 ◽  
Vol 89 (1-4) ◽  
pp. 933-940 ◽  
Author(s):  
Hansong Li ◽  
Guoqian Wang ◽  
Ningsong Qu ◽  
Di Zhu
Materials ◽  
2020 ◽  
Vol 13 (24) ◽  
pp. 5780
Author(s):  
Guoqian Wang ◽  
Yan Zhang ◽  
Hansong Li ◽  
Jian Tang

Micro-hole arrays have found wide applications in aerospace, precision instruments, and biomedicine. Among various methods of their production, including mechanical, laser, and electrical discharge, electrochemical machining (ECM) is considered the most lucrative due to its wide processing range, high surface quality, and excellent productivity. In particular, ultrasound-assisted through-mask ECM exhibits an enhanced machining precision due to ultrasonic cavitation, which promotes the removal of the electrolytic products and bubbles. In this study, the equation of cavitation bubble oscillation was derived and numerically solved to study the influence of six different parameters on the ultrasonic cavitation and electrolysis process, and their optimal values were determined. The feasibility of the proposed ultrasound-assisted through-mask ECM technology with the optimized parameters was experimentally corroborated by the fabrication of a high-quality hole array in an oxide dispersion strengthened (ODS) MA956 superalloy.


2014 ◽  
Vol 941-944 ◽  
pp. 2140-2144
Author(s):  
Xiao Hui Bao ◽  
Ping Mei Ming ◽  
Zhen Bin Lv

Basing on an inert perforated metal mask, a hybrid electrochemical fabrication combining electroforming and mask electrochemical machining was proposed to manufacture metal through-hole array with double tapered openings. The feasibility of this novel process was investigated experimentally. The effects of pattern parameters of inert metal mask, such as wall angle, α, substrate thickness, H, hole spacing, L and hole size, D, on profiles of the resulting holes were analyzed. The experimental results show that the hybrid fabrication is able to manufacture high-aspect-ratio double tapered hole array with good surface quality.


2021 ◽  
Author(s):  
Srinivasa Reddy Badduri ◽  
Ramesh Siripuram ◽  
Naga Srinivasulu G ◽  
Srinivasa Rao S

2010 ◽  
Vol 2010.23 (0) ◽  
pp. 301-302
Author(s):  
Genki HAYASHI ◽  
Litan Kuma SAHA ◽  
Nobuyuki OSHIMA

Sign in / Sign up

Export Citation Format

Share Document