Automated detection and classification of shoulder arthroplasty models using deep learning

2020 ◽  
Vol 49 (10) ◽  
pp. 1623-1632
Author(s):  
Paul H. Yi ◽  
Tae Kyung Kim ◽  
Jinchi Wei ◽  
Xinning Li ◽  
Gregory D. Hager ◽  
...  
2020 ◽  
Vol 133 ◽  
pp. 210-216 ◽  
Author(s):  
K. Shankar ◽  
Abdul Rahaman Wahab Sait ◽  
Deepak Gupta ◽  
S.K. Lakshmanaprabu ◽  
Ashish Khanna ◽  
...  

2021 ◽  
Vol 1 ◽  
pp. 100240
Author(s):  
Jiong Hao Tan ◽  
Lei Zhu ◽  
Kaiyuan Yang ◽  
Hiroshi Yoshioka ◽  
Beng Chin Ooi ◽  
...  

2018 ◽  
Vol 89 (4) ◽  
pp. 468-473 ◽  
Author(s):  
Seok Won Chung ◽  
Seung Seog Han ◽  
Ji Whan Lee ◽  
Kyung-Soo Oh ◽  
Na Ra Kim ◽  
...  

IEEE Access ◽  
2020 ◽  
Vol 8 ◽  
pp. 132677-132693 ◽  
Author(s):  
Roshan Alex Welikala ◽  
Paolo Remagnino ◽  
Jian Han Lim ◽  
Chee Seng Chan ◽  
Senthilmani Rajendran ◽  
...  

2020 ◽  
Vol 10 (10) ◽  
pp. 3423
Author(s):  
Hsiang-Chieh Chen

This article presents an automated vision-based algorithm for the die-scale inspection of wafer images captured using scanning acoustic tomography (SAT). This algorithm can find defective and abnormal die-scale patterns, and produce a wafer map to visualize the distribution of defects and anomalies on the wafer. The main procedures include standard template extraction, die detection through template matching, pattern candidate prediction through clustering, and pattern classification through deep learning. To conduct the template matching, we first introduce a two-step method to obtain a standard template from the original SAT image. Subsequently, a majority of the die patterns are detected through template matching. Thereafter, the columns and rows arranged from the detected dies are predicted using a clustering method; thus, an initial wafer map is produced. This map is composed of detected die patterns and predicted pattern candidates. In the final phase of the proposed algorithm, we implement a deep learning-based model to determine defective and abnormal patterns in the wafer map. The experimental results verified the effectiveness and efficiency of our proposed algorithm. In conclusion, the proposed method performs well in identifying defective and abnormal die patterns, and produces a wafer map that presents important information for solving wafer fabrication issues.


Radiology ◽  
2021 ◽  
pp. 204289
Author(s):  
James Thomas Patrick Decourcy Hallinan ◽  
Lei Zhu ◽  
Kaiyuan Yang ◽  
Andrew Makmur ◽  
Diyaa Abdul Rauf Algazwi ◽  
...  

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