Microstructure evolution and mechanical properties of the In–Sn–20Cu composite particles TLP bonding solder joints

2020 ◽  
Vol 126 (5) ◽  
Author(s):  
Li Yang ◽  
Yao Yang ◽  
Yaocheng Zhang ◽  
Feng Xu ◽  
Jian Qiao ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Microstructure Evolution ◽  
Solder Joints ◽  
Composite Particles ◽  
Tlp Bonding

Homogenization stage during TLP bonding of RAFM steel with a Fe–Si–B interlayer: Microstructure evolution and mechanical properties

2020 ◽  
Vol 780 ◽  
pp. 139205 ◽  
Author(s):  
Wenchao Li ◽  
Xiaohua Li ◽  
Yongchang Liu ◽  
Zumin Wang ◽  
Chenxi Liu ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Microstructure Evolution ◽  
Tlp Bonding ◽  
Rafm Steel
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