High-Temperature Thermal Conductivity Measurement Apparatus Based on Guarded Hot Plate Method

2017 ◽  
Vol 38 (10) ◽  
Author(s):  
E. Turzo-Andras ◽  
T. Magyarlaki
Keyword(s):  
Thermal Conductivity ◽  
High Temperature ◽  
Conductivity Measurement ◽  
Thermal Conductivity Measurement ◽  
Hot Plate ◽  
Plate Method ◽  
Guarded Hot Plate ◽  
Measurement Apparatus

scholarly journals Thermal Conductivity Measurement Method for the Thin Epoxy Adhesive Joint Layer

2021 ◽  
Vol 39 (4) ◽  
pp. 402-408
Author(s):  
Da-In Lim ◽  
So-Jeong Lee ◽  
Seung-Boo Jung ◽  
Jun-Ki Kim
Keyword(s):  
Thermal Conductivity ◽  
Adhesive Joint ◽  
Conductivity Measurement ◽  
Laser Flash ◽  
Laser Flash Method ◽  
Thermal Conductivity Measurement ◽  
Flash Method ◽  
Hot Plate ◽  
Plate Method ◽  
Guarded Hot Plate

Epoxy adhesives, particularly for non-conductive pastes, are used in 3D chip-stack flip-chip packages to reinforce the mechanical strength of joints. Although the thickness of the adhesive layer is relatively small, its thermal conductivity is known to have a major effect on the heat dissipation behavior of chipstack packages. Because conventional thermal conductivity measurement methods such as the laser flash method are based on the bulk specimens having thicknesses greater than several mm, they are limited in their ability to measure the thermal conductivity of thin adhesive layers between silicon dies. In this study, a modified guarded hot-plate method is proposed using standard joint layer samples of known thermal conductivity, and the measurement results are compared with those of the laser flash method. Results showed that, based on a constant heat flux from heat source to heat sink, the temperature difference at both sides of the joint layers was proportional to the thermal resistivity of the joint layer materials. The thermal conductivity of the under-test joint layer could therefore be determined from the thermal conductivity spectrum of the known samples using a graphical method. Although the measured values by the modified guarded hot-plate method were slightly higher than those derived from the laser flash method due to the thickness effect, it was concluded that the modified guarded hot-plate method could be a practical method in measuring the thermal conductivity of thin adhesive joint layers.

A passive guard for low thermal conductivity measurement of small samples by the hot plate method

2016 ◽  
Vol 28 (1) ◽  
pp. 015008 ◽  
Author(s):  
Yves Jannot ◽  
Alain Degiovanni ◽  
Veneta Grigorova-Moutiers ◽  
Justine Godefroy
Keyword(s):  
Thermal Conductivity ◽  
Conductivity Measurement ◽  
Thermal Conductivity Measurement ◽  
Small Samples ◽  
Hot Plate ◽  
Plate Method ◽  
Low Thermal Conductivity
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