Thermally aware performance analysis of single-walled carbon nanotube bundle as VLSI interconnects
2016 ◽
Vol 15
(2)
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pp. 407-419
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2013 ◽
Vol 28
(3)
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pp. 316-325
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2014 ◽
Vol 10
(3)
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pp. 479-494
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2005 ◽
Vol 65
(5)
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pp. 719-725
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2012 ◽
Vol 54
(1)
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pp. 149-157
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