Performance analysis of single‐walled carbon nanotube bundle interconnects for three‐dimensional integration applications

2013 ◽  
Vol 8 (1) ◽  
pp. 56-58 ◽  
Author(s):  
Libo Qian ◽  
Zhangming Zhu ◽  
Ruixue Ding ◽  
Yintang Yang
2017 ◽  
Vol 17 (8) ◽  
pp. 5900-5902
Author(s):  
Jongtaek Lee ◽  
Junyoung Lee ◽  
Jonghee Yang ◽  
Taehun Park ◽  
Sang Jung Ahn ◽  
...  

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