Optoelectronic characterization of zinc complexes for display device applications

2015 ◽  
Vol 26 (9) ◽  
pp. 6762-6768 ◽  
Author(s):  
Vandna Nishal ◽  
Devender Singh ◽  
Raman Kumar Saini ◽  
Shri Bhagwan ◽  
Vijeta Tanwar ◽  
...  
2017 ◽  
Vol 43 (12) ◽  
pp. 8886-8892 ◽  
Author(s):  
B. Naveen Kumar Reddy ◽  
B. Devaprasad Raju ◽  
K. Thyagarajan ◽  
R. Ramanaiah ◽  
Young-Dahl Jho ◽  
...  

2016 ◽  
Vol 11 (3) ◽  
pp. 305-310 ◽  
Author(s):  
Devender Singh ◽  
Vijeta Tanwar ◽  
Shri Bhagwan ◽  
Suman Sheoran ◽  
Vandna Nishal ◽  
...  

Optik ◽  
2016 ◽  
Vol 127 (10) ◽  
pp. 4254-4257 ◽  
Author(s):  
Vipin Kumar ◽  
D.K. Sharma ◽  
Kapil K. Sharma ◽  
Sonalika Agrawal ◽  
M.K. Bansal ◽  
...  

2001 ◽  
Vol 707 ◽  
Author(s):  
Ian C. Bache ◽  
Catherine M. Ramsdale ◽  
D. Steve Thomas ◽  
Ana-Claudia Arias ◽  
J. Devin MacKenzie ◽  
...  

ABSTRACTCharacterising the morphology of thin films for use in device applications requires the ability to study both the structure within the plane of the film, and also through its thickness. Environmental scanning electron microscopy has proved to be a fruitful technique for the study of such films both because contrast can be seen within the film without the need for staining (as is conventionally done for electron microscopy), and because cross-sectional images can be obtained without charging artefacts. The application of ESEM to a particular blend of relevance to photovoltaics is described.


2019 ◽  
Vol 33 (S1) ◽  
Author(s):  
Hunter S Weiland ◽  
Michael J Wolyniak ◽  
Paul H Mueller

2000 ◽  
Vol 639 ◽  
Author(s):  
D. Mistele ◽  
T. Rotter ◽  
R. Ferretti ◽  
F. Fedler ◽  
H. Klausing ◽  
...  

ABSTRACTPhotoanodically grown Ga2O3 layers were characterized with respect to their suitability as gate dielectrics for GaN based MOSFET Device applications. The Ga2O3 layers were produced in a photoelectrochemical cell using aqueous solutions of KOH. IV characterization of MOS structures show insulating behavior of the oxide layers and CV measurements indicate a small density of states at the oxide/GaN interface. Integrating the wet chemical oxide growth in a MOSFET device fabricating process includes tungsten as gate metal together with H2O2 as etching solution for the gate metal. Source/drain areas were made free of oxide by the alkaline developer of a conventional lithographic step and metallization was done by using the liftoff technique. MOS structures show no inversion mode but strong depletion in reverse biasing mode.


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