Void fraction of a Sn–Ag–Cu solder joint underneath a chip resistor and its effect on joint strength and thermomechanical reliability

2019 ◽  
Vol 30 (17) ◽  
pp. 15889-15896
Author(s):  
Wonil Seo ◽  
Yong-Ho Ko ◽  
Young-Ho Kim ◽  
Sehoon Yoo
Keyword(s):  
Solder Joint ◽  
Void Fraction ◽  
Joint Strength ◽  
Thermomechanical Reliability

Reballing/Rebumping Ultra-Fine Pitch Packages Less Than 0.5 mm Pitch for FA

2014 ◽  
Author(s):  
Bob Wettermann
Keyword(s):  
Solder Joint ◽  
Failure Analysis ◽  
Joint Strength ◽  
Semiconductor Devices ◽  
X Ray ◽  
Fine Pitch ◽  
Manual Methods

Abstract As the pitch and package sizes of semiconductor devices have shrunk and their complexity has increased, the manual methods by which the packages can be re-bumped or reballed for failure analysis have not kept up with this miniaturization. There are some changes in the types of reballing preforms used in these manual methods along with solder excavation techniques required for packages with pitches as fine as 0.3mm. This paper will describe the shortcomings of the previous methods, explain the newer methods and materials and demonstrate their robustness through yield, mechanical solder joint strength and x-ray analysis.

Evaluation of BGA Solder Joint Strength under Fast Four-point Bending Load

2003 ◽  
Vol 2003.6 (0) ◽  
pp. 229-230
Author(s):  
Toshihiro MATSUNAGA ◽  
Yasumi UEGAI ◽  
Kozo HARADA ◽  
Shinji BABA ◽  
Qiang Wu
Keyword(s):  
Solder Joint ◽  
Joint Strength ◽  
Four Point Bending ◽  
Bending Load

Finite-element analysis of solder joint strength in laser diode packaging

2000 ◽  
Author(s):  
Chi-Hsiung Chang ◽  
Maw-Tyan Sheen ◽  
Jao-Hwa Kuang ◽  
Chi-Chen Chen ◽  
Gol-Lin Wang ◽  
...  
Keyword(s):  
Finite Element Analysis ◽  
Finite Element ◽  
Solder Joint ◽  
Laser Diode ◽  
Joint Strength ◽  
Element Analysis
Sign in / Sign up

Export Citation Format

Share Document