Effects of eucommia gum filler on the dielectric properties and chemical resistances of addition-cure liquid silicone rubber

Author(s):  
Chaohua Li ◽  
Shengpei Su ◽  
Bikui Wang ◽  
Jijia Zhou
RSC Advances ◽  
2019 ◽  
Vol 9 (49) ◽  
pp. 28851-28856 ◽  
Author(s):  
Zhenzhen Ou ◽  
Feng Gao ◽  
Huaijun Zhao ◽  
Shumeng Dang ◽  
Lingjian Zhu

The present work aims at studying the thermal and dielectric properties of addition-cure liquid silicone rubber (ALSR) matrix composites using boron nitride (BN) and aluminum nitride (AlN) as a hybrid thermal conductive filler.


2021 ◽  
Author(s):  
Chaohua Li ◽  
Shengpei Su ◽  
Bikui Wang ◽  
Jijia Zhou

Abstract It is of great interest and remains a challenge to simultaneously improve the low-dielectric properties and chemical resistances of addition-cure liquid silicone rubber (ALSR). In this work, we proposed an efficient approach to address this issue by filling silicone-modified eucommia gum nanofiller (SEUG) into ALSR. By adding 5 wt% SEUG, the dielectric constant of the SEUG/ALSR composite rubber was significantly lower than that of neat ALSR both at 102 Hz, 103 Hz and 104 Hz. Simultaneously, the SEUG/ALSR composite rubber exhibited better mechanical and insulation properties than the neat ALSR after HCl, NaCl, and oil resistance tests. Our findings demonstrated the great potential for fabricating silicone rubber with low-dielectric properties and erosion resistance by the utilization natural biomass rubber material, endowing it with excellent mechanical performance and degradability.


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