Analysis of heat pipe-aided graphene-oxide based nanoparticle-enhanced phase change material heat sink for passive cooling of electronic components

2020 ◽  
Author(s):  
Hafiz Muhammad Ali
Keyword(s):  
Graphene Oxide ◽  
Phase Change ◽  
Heat Pipe ◽  
Phase Change Material ◽  
Heat Sink ◽  
Passive Cooling ◽  
Electronic Components ◽  
Change Material

Numerical study of nanocomposite phase change material-based heat sink for the passive cooling of electronic components

2021 ◽  
Author(s):  
Adeel Arshad ◽  
Mark Jabbal ◽  
Hamza Faraji ◽  
Pouyan Talebizadehsardari ◽  
Muhammad Anser Bashir ◽  
...  
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Heat Sink ◽  
Numerical Study ◽  
Passive Cooling ◽  
Electronic Components ◽  
Change Material

Thermal performance of heat sink using nano-enhanced phase change material (NePCM) for cooling of electronic components

2021 ◽  
Vol 121 ◽  
pp. 114144
Author(s):  
Anuj Kumar ◽  
Rohit Kothari ◽  
Santosh Kumar Sahu ◽  
Shailesh Ishwarlal Kundalwal
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Thermal Performance ◽  
Heat Sink ◽  
Electronic Components ◽  
Change Material

Numerical Study of Cyclic Melting and Solidification of Nano Enhanced Phase Change Material Based Heat Sink in Thermal Management of Electronic Components

2016 ◽  
Author(s):  
S. K. Sahoo ◽  
M. K. Das ◽  
P. Rath
Keyword(s):  
Phase Change ◽  
Phase Change Material ◽  
Thermal Management ◽  
Forced Convection ◽  
Heat Sink ◽  
Volume Concentration ◽  
Nano Particles ◽  
Nano Particle ◽  
Electronic Components ◽  
Change Material

The Present investigation has been carried out to study the performance of nano enhanced phase change material (NEPCM) based heat sink for thermal management of electronic components. Enthalpy based finite volume method is used for the analysis of phase change process in NEPCM. To enhance the thermal conductivity of phase change material (PCM), copper oxide nano particles of volume fractions 1%, 2.5% and 5% are added to PCM. A heat flux of 2500 W/m2 is taken as input to the heat sink. The thermal performance of the heat sink with PCM is compared with NEPCM for each volume fraction of nano particle for both finned and unfinned configurations. It is observed that the nano particle volume concentration plays a major role in removing the heat from the chip in case of unfinned heat sink configuration. However, for finned heat sink configuration, the volume concentration effect is not appreciable. In addition, the performance of NEPCM based finned heat sink is studied under cyclic loading in both natural and forced convection boundary conditions. It is observed that under forced convection the solidification time is reduced.

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