Numerical study of nanocomposite phase change material-based heat sink for the passive cooling of electronic components

Author(s):  
Adeel Arshad ◽  
Mark Jabbal ◽  
Hamza Faraji ◽  
Pouyan Talebizadehsardari ◽  
Muhammad Anser Bashir ◽  
...  
2016 ◽  
Vol 25 ◽  
pp. 1182-1190 ◽  
Author(s):  
Jesto Thomas ◽  
P.V.S.S. Srivatsa ◽  
S. Ramesh Krishnan ◽  
Rajesh Baby

Author(s):  
S. K. Sahoo ◽  
M. K. Das ◽  
P. Rath

The Present investigation has been carried out to study the performance of nano enhanced phase change material (NEPCM) based heat sink for thermal management of electronic components. Enthalpy based finite volume method is used for the analysis of phase change process in NEPCM. To enhance the thermal conductivity of phase change material (PCM), copper oxide nano particles of volume fractions 1%, 2.5% and 5% are added to PCM. A heat flux of 2500 W/m2 is taken as input to the heat sink. The thermal performance of the heat sink with PCM is compared with NEPCM for each volume fraction of nano particle for both finned and unfinned configurations. It is observed that the nano particle volume concentration plays a major role in removing the heat from the chip in case of unfinned heat sink configuration. However, for finned heat sink configuration, the volume concentration effect is not appreciable. In addition, the performance of NEPCM based finned heat sink is studied under cyclic loading in both natural and forced convection boundary conditions. It is observed that under forced convection the solidification time is reduced.


Author(s):  
Ingrid Cotoros ◽  
Ab Hashemi

A numerical model and analysis has been performed on a state-of-the art one shot heat sink including an eicosane/carbon nanotubes (CNT) system of nano-enhanced phase change material (NEPCM). The nanoparticles, dispersed in the PCM liquid phase, can form a network of interconnected ballistic heat transport lines, thus increasing the thermal conductivity of the PCM by almost two orders of magnitude. The results show that the heat sink can be operated with a 40% higher heat load, for an extra 42% time, or with a 29% lighter mass, before the electronics reach the allowable maximum temperature.


Sign in / Sign up

Export Citation Format

Share Document