Specific Features of Electroplastic Effect in Mono- and Polycrystalline Aluminum

2021 ◽  
Author(s):  
M. A. Pakhomov ◽  
V. V. Stolyarov
Keyword(s):  
Electroplastic Effect ◽  
Polycrystalline Aluminum

Transmission Electron Microscopy Studies of Aluminum Oxidation

1985 ◽  
Vol 43 ◽  
pp. 268-269
Author(s):  
J.Y. Lee
Keyword(s):  
Nucleation And Growth ◽  
Ion Milling ◽  
Cross Sectional ◽  
Polycrystalline Aluminum ◽  
Axis Orientation ◽  
Temperature Oxidation ◽  
Aluminum Oxidation ◽  
Transmission Electron ◽  
High Resolution Images ◽  
Argon Ion

In the oxidation of metals and alloys, microstructural features at the atomic level play an important role in the nucleation and growth of the oxide, but little is known about the atomic mechanisms of high temperature oxidation. The present paper describes current progress on crystallographic aspects of aluminum oxidation. The 99.999% pure, polycrystalline aluminum was chemically polished and oxidized in 1 atm air at either 550°C or 600°C for times from 0.5 hr to 4 weeks. Cross-sectional specimens were prepared by forming a sandwich with epoxy, followed by mechanical polishing and then argon ion milling. High resolution images were recorded in a <110>oxide zone-axis orientation with a JE0L JEM 200CX microscope operated at 200 keV.

Enhancement of the tensile shear strength for joining low-ductility aluminium to high-strength steel by using electrically-assisted mechanical clinching (EAMC)

2021 ◽  
pp. 095440542199565
Author(s):  
Abozar Barimani-Varandi ◽  
Abdolhossein Jalali Aghchai
Keyword(s):  
Shear Strength ◽  
High Strength Steel ◽  
High Strength ◽  
Fe Model ◽  
Tensile Shear Strength ◽  
Tensile Shear ◽  
Electroplastic Effect ◽  
Fracture Displacement ◽  
Electrically Assisted ◽  
Mechanical Clinching

The present work studied the enhancement of the tensile shear strength for joining AA6061-T6 aluminium to galvanized DP590 steel via electrically-assisted mechanical clinching (EAMC) using an integrated 2D FE model. To defeat the difficulties of joining low-ductility aluminium alloy to high-strength steel, the electroplastic effect obtained from the electrically-assisted process was applied to enhance the clinch-ability. For this purpose, the results of experiments performed by the chamfering punches with and without electrically-assisted pre-heating were compared. Joint cross-section, failure load, failure mode, fracture displacement, material flow, and failure mechanism were assessed in order to study the failure behaviour. The results showed that the joints clinched at the EAMC condition failed with the dominant dimpled mechanism observed on the fracture surface of AA6061 side, achieved from the athermal effect of the electroplasticity. Besides, these joints were strengthened 32% with a much more fracture displacement around 20% compared with non-electrically-assisted pre-heating.

1/fnoise in mono- and polycrystalline aluminum

1998 ◽  
Vol 57 (1) ◽  
pp. 53-55 ◽  
Author(s):  
M. J. C. van den Homberg ◽  
A. H. Verbruggen ◽  
P. F. A. Alkemade ◽  
S. Radelaar ◽  
E. Ochs ◽  
...  
Keyword(s):  
Polycrystalline Aluminum

Laser irradiation effects on high dose implanted Cu and Pb in polycrystalline aluminum

1980 ◽  
Vol 46 (3-4) ◽  
pp. 133-139 ◽  
Author(s):  
G. Della Mea ◽  
L. Donà Dalle Rose ◽  
P. Mazzoldi ◽  
A. Miotello
Keyword(s):  
Laser Irradiation ◽  
High Dose ◽  
Irradiation Effects ◽  
Polycrystalline Aluminum

Microstructure-based numerical analysis of the dynamic deformation of polycrystalline aluminum

2018 ◽  
Author(s):  
R. R. Balokhonov ◽  
V. A. Romanova ◽  
S. Schmauder ◽  
M. V. Sergeev ◽  
E. S. Emelianova ◽  
...  
Keyword(s):  
Numerical Analysis ◽  
Dynamic Deformation ◽  
Polycrystalline Aluminum

Properties and Fracture Resistance of Thin Polycrystalline Aluminum Films on Sapphire Substrates

1995 ◽  
Vol 403 ◽  
Author(s):  
N. R. Moody ◽  
D. Medlin ◽  
S. Guthrie ◽  
R. Q. Hwang ◽  
K. F. McCarty
Keyword(s):  
Polycrystalline Aluminum ◽  
Plastic Properties ◽  
Aluminum Films ◽  
Sapphire Substrates ◽  
Nominal Thickness ◽  
High Resolution Tem ◽  
Interface Hardness ◽  
Thin Polycrystalline ◽  
Film Substrate ◽  
Single Crystal Sapphire

AbstractWe employed nanoindentation, continuous microscratch testing, and high resolution TEM to determine the effect of structure on the properties and resistance to fracture of thin polycrystalline aluminum films deposited onto single crystal sapphire substrates at 25°C and 250°C. These films had a nominal thickness of 90 nm and a grain size of 160 nm. The elastic and plastic properties were similar for both films. The elastic moduli superimposed, increasing from bulk aluminum values at the surface to sapphire values at the interface. Hardness values also superimposed, but were constant through the film thickness at a value between aluminum and sapphire. In contrast, susceptibility to fracture varied markedly between the films with the 25°C film exhibiting abrupt failure along the film-substrate interface while the 250'C film gave no indication of fracture in the film, along the interface, or in the substrate under the conditions tested.

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