elemental redistribution and interfacial reaction mechanism for the flip chip Sn-3.0Ag-(0.5 or 1.5)Cu solder bump with Al/Ni(V)/Cu under-Bump metallization during aging

2006 ◽  
Vol 35 (11) ◽  
pp. 2061-2070 ◽  
Author(s):  
Guh-Yaw Jang ◽  
Jenq-Gong Duh
Keyword(s):  
Reaction Mechanism ◽  
Interfacial Reaction ◽  
Flip Chip ◽  
Solder Bump ◽  
Under Bump Metallization

Mechanism of interfacial reaction for the Sn-Pb solder bump with Ni/Cu under-bump metallization in flip-chip technology

2004 ◽  
Vol 33 (10) ◽  
pp. 1118-1129 ◽  
Author(s):  
Guh-Yaw Jang ◽  
Chien-Sheng Huang ◽  
Li-Yin Hsiao ◽  
Jenq-Gong Duh ◽  
Hideyuki Takahashi
Keyword(s):  
Interfacial Reaction ◽  
Flip Chip ◽  
Solder Bump ◽  
Under Bump Metallization ◽  
Chip Technology

Solid state interfacial reaction and joint strength of Sn–37Pb solder with Ni–P under bump metallization in flip chip application

2005 ◽  
Vol 395 (1-2) ◽  
pp. 80-87 ◽  
Author(s):  
Dae-Gon Kim ◽  
Jong-Woong Kim ◽  
Jung-Goo Lee ◽  
Hirotaro Mori ◽  
David J. Quesnel ◽  
...  
Keyword(s):  
Solid State ◽  
Interfacial Reaction ◽  
Joint Strength ◽  
Flip Chip ◽  
Under Bump Metallization

Interfacial Reaction and Bump Shear Property of Electroplated Sn-37Pb Solder Bump with Ni under Bump Metallization during Multiple Reflows

2006 ◽  
Vol 15-17 ◽  
pp. 181-186
Author(s):  
Ja Myeong Koo ◽  
Seung Boo Jung
Keyword(s):  
Intermetallic Compound ◽  
Brittle Fracture ◽  
Interfacial Reaction ◽  
Solder Bump ◽  
Ductile Failure ◽  
Under Bump Metallization ◽  
Shear Properties ◽  
Failure Characteristics ◽  
Shear Property ◽  
Solder Bumps

The interfacial reactions and bump shear properties of the electroplated Sn-37Pb (in wt.%) solder bumps with the Ni under bump metallization (UBM) were investigated as a function of the number of reflows. A continuous facetted Ni3Sn4 intermetallic compound (IMC) layer was formed at the interface between the solder bump and the Ni UBM during reflow. The thickness of the Ni3Sn4 IMC layer was 0.41 μm after 1 reflow, and then the thickness of the IMC layer increased with increasing the number of reflows. The shear properties of the bumps indicated the maximum values after 1 reflow, and then decreased with increasing the number of reflows. The fracture surfaces of the bumps showed ductile failure characteristics after 1 reflow, and then the fraction of the brittle fracture, induced by the IMC formed at the interface, increased with increasing the number of reflows.

scholarly journals Interfacial Reaction Between 95Pb-5Sn Solder Bump and 37Pb-63Sn Presolder in Flip-Chip Solder Joints

2010 ◽  
Vol 39 (8) ◽  
pp. 1289-1294 ◽  
Author(s):  
C. C. Chang ◽  
Y. W. Wang ◽  
Y. S. Lai ◽  
C. R. Kao
Keyword(s):  
Interfacial Reaction ◽  
Flip Chip ◽  
Solder Bump ◽  
Solder Joints

Interfacial reaction and joint reliability of fine-pitch flip-chip solder bump using stencil printing method

2007 ◽  
Vol 84 (11) ◽  
pp. 2640-2645 ◽  
Author(s):  
Sang-Su Ha ◽  
Dae-Gon Kim ◽  
Jong-Woong Kim ◽  
Jeong-Won Yoon ◽  
Jin-Ho Joo ◽  
...  
Keyword(s):  
Interfacial Reaction ◽  
Flip Chip ◽  
Solder Bump ◽  
Stencil Printing ◽  
Joint Reliability ◽  
Fine Pitch ◽  
Printing Method
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