Sn-Ag-Cu Solder Joint Microstructure and Orientation Evolution as a Function of Position and Thermal Cycles in Ball Grid Arrays Using Orientation Imaging Microscopy

2010 ◽  
Vol 39 (12) ◽  
pp. 2588-2597 ◽  
Author(s):  
Tae-Kyu Lee ◽  
Bite Zhou ◽  
Lauren Blair ◽  
Kuo-Chuan Liu ◽  
Thomas R. Bieler
Keyword(s):  
Solder Joint ◽  
Orientation Imaging Microscopy ◽  
Thermal Cycles ◽  
Ball Grid Arrays ◽  
Joint Microstructure ◽  
Orientation Imaging ◽  
Solder Joint Microstructure

The Effect of Solder Joint Microstructure on the Drop Test Failure—A Peridynamic Analysis

2019 ◽  
Vol 9 (1) ◽  
pp. 58-71 ◽  
Author(s):  
Javad Mehrmashhadi ◽  
Yuye Tang ◽  
Xiaoliang Zhao ◽  
Zhanping Xu ◽  
Jianbiao John Pan ◽  
...  
Keyword(s):  
Solder Joint ◽  
Drop Test ◽  
Joint Microstructure ◽  
Solder Joint Microstructure ◽  
Test Failure

Effects of Surface Finish on Sn-3.0Ag-0.5Cu Solder Joint Microstructure and Strength

2021 ◽  
Author(s):  
S. F. N. Muhd Amli ◽  
M. A. A. Mohd Salleh ◽  
M. I. I. Ramli ◽  
N. R. Abdul Razak ◽  
H. Yasuda ◽  
...  
Keyword(s):  
Solder Joint ◽  
Surface Finish ◽  
Joint Microstructure ◽  
Solder Joint Microstructure

Thermal cycling aging effects on Sn–Ag–Cu solder joint microstructure, IMC and strength

2004 ◽  
Vol 462-463 ◽  
pp. 370-375 ◽  
Author(s):  
John H.L. Pang ◽  
T.H. Low ◽  
B.S. Xiong ◽  
Xu Luhua ◽  
C.C. Neo
Keyword(s):  
Solder Joint ◽  
Thermal Cycling ◽  
Aging Effects ◽  
Joint Microstructure ◽  
Solder Joint Microstructure

Effect of Cu content on the mechanical reliability of Ni/Sn–3.5Ag system

2007 ◽  
Vol 22 (3) ◽  
pp. 770-776 ◽  
Author(s):  
J.Y. Kim ◽  
Y.C. Sohn ◽  
Jin Yu
Keyword(s):  
Solder Joint ◽  
Shear Test ◽  
Test Results ◽  
Under Bump Metallization ◽  
Mechanical Reliability ◽  
Ball Shear ◽  
Cu Content ◽  
Joint Microstructure ◽  
Ball Shear Test ◽  
Solder Joint Microstructure

Copper was supplied to Sn–3.5Ag by electroplating Cu/Ni double under-bump metallization (UBM), and the amount of Cu was controlled by varying the Cu UBM thickness. Supposed Cu contents in the solder were; 0.2, 0.5, and 1.0 wt%, respectively, and the solder joint microstructure was investigated after 1, 5, and 10 reflows. In the case of specimens with 0.2 and 1.0 wt% Cu, only one type of intermetallic compound (IMC) formed, either (Cu,Ni)6Sn5 or (Ni,Cu)3Sn4, while two types formed in specimen with 0.5 wt% Cu. No correlation could be found between the solder joint microstructure and the ball shear test. However, drop test results showed two opposite trends. The drop resistance of 0.2 and 1.0 wt% Cu specimens was quite good initially but degraded dramatically with multiple reflows, in contrast to that of the 0.5 wt% Cu specimen, which was very poor after one reflow but improved substantially later on. The former was ascribed to thickening of IMC during reflow, while the latter was related to (Ni,Cu)3Sn4 thickening beneath (Cu,Ni)6Sn5 and subsequent spalling of (Cu,Ni)6Sn5 from (Ni,Cu)3Sn4.

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