Effect of Thermal Cycling on Interfacial Microstructure and Mechanical Properties of Sn-0.3Ag-0.7Cu-(α-Al2O3) Nanoparticles/Cu Low-Ag Solder Joints

2019 ◽  
Vol 48 (7) ◽  
pp. 4562-4572 ◽  
Author(s):  
Jie Wu ◽  
Songbai Xue ◽  
Jingwen Wang ◽  
Peng Xue
Keyword(s):  
Mechanical Properties ◽  
Thermal Cycling ◽  
Solder Joints ◽  
Interfacial Microstructure ◽  
Al2o3 Nanoparticles ◽  
Microstructure And Mechanical Properties ◽  
Α Al2o3

Effects of Joint Height on the Interfacial Microstructure and Mechanical Properties of Cu-Cored SAC305 Solder Joints

2020 ◽  
Vol 49 (9) ◽  
pp. 5391-5398
Author(s):  
Zongxiang Yao ◽  
Shan Jiang ◽  
Limeng Yin ◽  
Diying Ling ◽  
Zhongwen Zhang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Solder Joints ◽  
Interfacial Microstructure ◽  
Sac305 Solder ◽  
Microstructure And Mechanical Properties

Interfacial microstructure and mechanical properties of titanium/steel dissimilar joining

2022 ◽  
Vol 307 ◽  
pp. 131069
Author(s):  
Qiaoling Chu ◽  
Tuo Xia ◽  
Lin Zhang ◽  
Pengkang Zhao ◽  
Min Zhang ◽  
...  
Keyword(s):  
Mechanical Properties ◽  
Interfacial Microstructure ◽  
Dissimilar Joining ◽  
Microstructure And Mechanical Properties

scholarly journals Study on Microstructure and Mechanical Properties of WC-10Ni3Al Cemented Carbide Prepared by Different Ball-Milling Suspension

Materials ◽  
2019 ◽  
Vol 12 (14) ◽  
pp. 2224 ◽  
Author(s):  
Minai Zhang ◽  
Zhun Cheng ◽  
Jingmao Li ◽  
Shengguan Qu ◽  
Xiaoqiang Li
Keyword(s):  
Mechanical Properties ◽  
Fracture Toughness ◽  
Ball Milling ◽  
Grain Growth ◽  
Organic Solvents ◽  
Crack Deflection ◽  
Cemented Carbides ◽  
Powder Metallurgy Method ◽  
Microstructure And Mechanical Properties ◽  
Α Al2o3

In this paper, WC-10Ni3Al cemented carbides were prepared by the powder metallurgy method, and the effects of ball-milling powders with two different organic solvents on the microstructure and mechanical properties of cemented carbides were studied. We show that the oxygen in the organic solvent can be absorbed into the mixed powders by ball-milling when ethanol (CH3CH2OH) is used as a ball-milling suspension. This oxygen leads to the formation of α-Al2O3 during sintering, which improves the fracture toughness, due to crack deflection and bridging, while the formation of η-phase (Ni3W3C) inhibits the grain growth and increases the hardness. Alternatively, samples milled using cyclohexane (C6H12) showed grain growth during processing, which led to a decrease in hardness. Therefore, the increase of oxygen content from using organic solvents during milling improves the properties of WC-Ni3Al composites. The growth of WC grains can be inhibited and the hardness can be improved without loss of toughness by self-generating α-Al2O3 and η-phase (Ni3W3C).

Reliability of Underfill-Encapsulated Flip-Chips With Heat Spreaders

1998 ◽  
Vol 120 (4) ◽  
pp. 322-327 ◽  
Author(s):  
H. Doi ◽  
K. Kawano ◽  
A. Yasukawa ◽  
T. Sato
Keyword(s):  
Mechanical Properties ◽  
Fatigue Life ◽  
Thermal Cycling ◽  
Failure Mode ◽  
Flip Chip ◽  
Solder Joints ◽  
Alumina Substrate ◽  
Heat Spreader ◽  
Flip Chips ◽  
Heat Spreaders

The effect of a heat spreader on the life of the solder joints for underfill-encapsulated, flip-chip packages is investigated through stress analyses and thermal cycling tests. An underfill with suitable mechanical properties is found to be able to prolong the fatigue life of the solder joints even in a package with a heat spreader and an alumina substrate. The delamination of the underfill from the chip is revealed as another critical failure mode for which the shape of the underfill fillet has a large effect.

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