Interfacial Reactions Between Lead-Free Solders and Ni-Pd-Co Alloys

JOM ◽  
2019 ◽  
Vol 71 (9) ◽  
pp. 3031-3040
Author(s):  
Yee-Wen Yen ◽  
Hsien-Ming Hsiao ◽  
Kuo-Jung Chen ◽  
Yi-Show Lin ◽  
Mei-Ting Lai
Keyword(s):  
Interfacial Reactions ◽  
Lead Free ◽  
Lead Free Solders ◽  
Co Alloys

Interfacial reactions of Sn–58Bi and Sn–0.7Cu lead-free solders with Alloy 42 substrate

2014 ◽  
Vol 54 (1) ◽  
pp. 233-238 ◽  
Author(s):  
Yee-Wen Yen ◽  
Ruo-Syun Syu ◽  
Chih-Ming Chen ◽  
Chien-Chung Jao ◽  
Guan-Da Chen
Keyword(s):  
Interfacial Reactions ◽  
Lead Free ◽  
Lead Free Solders

Interfacial Reactions Between Lead-Free Solders and Common Base Materials

ChemInform ◽  
2006 ◽  
Vol 37 (30) ◽  
Author(s):  
T. Laurila ◽  
V. Vuorinen ◽  
J. K. Kivilahti
Keyword(s):  
Interfacial Reactions ◽  
Lead Free ◽  
Base Materials ◽  
Common Base ◽  
Lead Free Solders

Effect of Zn Addition on the Interfacial Reactions between Cu and Lead-Free Solders

2006 ◽  
Vol 968 ◽  
Author(s):  
Su-Chun Yang ◽  
Cheng-En Ho ◽  
Chien-Wei Chang ◽  
C. Robert Kao
Keyword(s):  
Phase Diagram ◽  
Interfacial Reactions ◽  
Lead Free ◽  
Slight Variation ◽  
Zn Addition ◽  
Zn Concentration ◽  
Cu Substrates ◽  
Kirkendall Voids ◽  
Low X ◽  
Lead Free Solders

ABSTRACTRecently, it was reported that adding Zn to solder was an effective way for reducing the formation of both Cu3Sn and Cu6Sn5 and inhibiting Kirkendall voids formation. The objective of this study is to investigate this Zn effect in detail. Three Sn-xZn solders (x = 0.5, 0.7, and 2 wt. %) were reacted with Cu substrates at 250°J for 2-10 mins. A slight variation in the Zn concentration changed the reaction product formed at the interface. When the Zn concentration was low (x = 0.5 wt. %), the reaction product was Cu6Sn5. At high Zn concentration (x = 2 wt. %), the reaction product became Cu5Zn8. When Zn concentration was in-between (x = 0.7 wt. %), Cu6Sn5 and CuZn co-existed. The above findings are explained using the Cu–Sn–Zn phase diagram. The implication is that the type of compound forms at the interface can be controlled by adjusting the Zn concentration of the Sn-based solders.

Interfacial Reactions of Sn-58Bi and Sn-9Zn Lead-Free Solders with Au/Ni/SUS304 Multilayer Substrate

2010 ◽  
Vol 39 (11) ◽  
pp. 2412-2417 ◽  
Author(s):  
Yee-Wen Yen ◽  
Da-Wei Liaw ◽  
Kuen-Da Chen ◽  
Hao Chen
Keyword(s):  
Interfacial Reactions ◽  
Lead Free ◽  
Lead Free Solders ◽  
Multilayer Substrate

Transmission electron microscopy studies of interfacial reactions and void formation in lead-free solders with minor elements

2010 ◽  
Vol 25 (7) ◽  
pp. 1304-1311 ◽  
Author(s):  
Y.T. Chin ◽  
P.K. Lam ◽  
H.K. Yow ◽  
T.Y. Tou
Keyword(s):  
Surface Finish ◽  
Intermetallic Layer ◽  
Void Formation ◽  
Electroless Nickel ◽  
Interfacial Reactions ◽  
Lead Free ◽  
Form Complex ◽  
Minor Elements ◽  
Transmission Electron ◽  
Lead Free Solders

Electroless nickel (Ni–P) is a common surface finish used in the ball grid array (BGA) package and interfacial reactions between its surface finish and lead-free solders can form complex intermetallic compound (IMC) layers. The presence of minor elements in lead-free solders either intentionally added or due to impurity contamination during solder manufacturing, can affect the solder-joint performance. In this work, interfacial reactions between Ni–P surface finish and the Sn–Ag–Cu solders were modified by varying Ag and Cu contents and also by adding a small amount of minor elements such as phosphorus (P), indium (In), and germanium (Ge). A transmission electron microscope was used to determine the intermetallic layer phases, compositions, crystal structures, and void defects. Varying the solder alloy elements led to the modulation of voids formation.

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