Characteristics of Copper Nitride Nanolayer Used in 3D Cu Bonding Interconnects

2021 ◽  
Author(s):  
Haesung Park ◽  
Hankyeol Seo ◽  
Sarah Eunkyung Kim
Keyword(s):  
Copper Nitride ◽  
Cu Bonding

Cu-Cu Bonding using Optimized Copper Nitride Passivation for 3D Packaging Applications

2021 ◽  
Author(s):  
Haesung Park ◽  
Seungmin Park ◽  
Yoonho Kim ◽  
Sarah Eunkyung Kim
Keyword(s):  
Copper Nitride ◽  
3D Packaging ◽  
Cu Bonding

Pressureless Cu–Cu bonding using hybrid Cu–epoxy paste and its reliability

2021 ◽  
Author(s):  
Byeong-Uk Hwang ◽  
Kwang-Ho Jung ◽  
Kyung Deuk Min ◽  
Choong-Jae Lee ◽  
Seung-Boo Jung
Keyword(s):  
Cu Bonding

Anomalous output performance enhancement of RGO-based triboelectric nanogenerators by Cu-bonding

Nano Energy ◽  
2021 ◽  
Vol 86 ◽  
pp. 106126
Author(s):  
Ruey-Chi Wang ◽  
Yu-Cheng Lin ◽  
Po-Tsang Chen ◽  
Hsiu-Cheng Chen ◽  
Wan-Ting Chiu
Keyword(s):  
Performance Enhancement ◽  
Output Performance ◽  
Triboelectric Nanogenerators ◽  
Cu Bonding

scholarly journals Ambiphilic Al‐Cu Bonding

2021 ◽  
Author(s):  
Michael Stephen Hill ◽  
Han-Ying Liu ◽  
Ryan Schwamm ◽  
Claire McMullin ◽  
Mary Mahon ◽  
...  
Keyword(s):  
Cu Bonding

scholarly journals Ambiphilic Al‐Cu Bonding

2021 ◽  
Author(s):  
Michael Stephen Hill ◽  
Han-Ying Liu ◽  
Ryan Schwamm ◽  
Claire McMullin ◽  
Mary Mahon ◽  
...  
Keyword(s):  
Cu Bonding

A copper nitride catalyst for the efficient hydroxylation of aryl halides under ligand-free conditions

2021 ◽  
Author(s):  
Hang Xu ◽  
Sho Yamaguchi ◽  
Takato Mitsudome ◽  
Tomoo Mizugaki
Keyword(s):  
Catalytic Activity ◽  
Heterogeneous Catalyst ◽  
Aryl Halides ◽  
High Catalytic Activity ◽  
Copper Nitride ◽  
Ligand Free

Copper nitride (Cu3N) was used as a heterogeneous catalyst for the hydroxylation of aryl halides under ligand-free conditions. The cubic Cu3N nanoparticles showed high catalytic activity, comparable to those of...

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